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Electronics-Related
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MCL-E-67 EGEA-67N <prepreg> |
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 Semiconductor-Related |
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Type No. MCL-E-67 is a FR-4
multilayer material which has excellent properties of CAF as well as various
electric and mechanical properties. This material is suitable for cellular
phone, electric switching equipment, PCs and wide range of other applications.
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Display
& Optics-Related |
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Base
Materials for PWBs |
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 Glass Epoxy Multilayer Material |
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 Halogen Free Multilayer Material |
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High Heat Resistance Multilayer Material (FR-4) |
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High Tg Glass Epoxy Multilayer Material <MCL> |
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Features |
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High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
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Excellent CAF property. |
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Excellent electric and mechanical properties. |
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Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
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Reduction in secondary lamination time, depending on the type of prepreg
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lamination condition. |
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Please be noted that this product is not made specifically for the application
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High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
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lamination. |
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Low Dissipation Factor, High Heat Resistance Multilayer aterial |
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Low Transmission Loss Material |
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Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
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Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
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Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Low Press Temperature, Adhesive Film (AS-2600) |
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Printed Wiring Boards |
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Advanced Performance Products |
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Products Category List |
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Products Alphabetical List |
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HOME |
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Hitachi Chemical. Co, Ltd. |
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