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Electronics-Related
Materials |
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MCL-BE-67G(H) E GEA-67BE(H) <prepreg> |
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Semiconductor-Related |
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"Green Multilayer material ""Type
No. MCL-BE-67G(H)"" has achieved the UL94V-0 level of flammability, by developing
an original thermosetting resin that has excellent anti-flammability property
without using any compounds which includes halogen, antimony, or red phosphorus.
This material has good heat resistance and high elastic modulus at high
temperature, and low CTE. So it is advantageous for the soldering process
at the high temperature lead-free solder, and it is suitable for high density
interconnection technology." |
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Display
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Base
Materials for PWBs |
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Glass Epoxy Multilayer Material |
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Halogen Free Multilayer Material |
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High Heat Resistance Multilayer Material (FR-4) |
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High Tg Glass Epoxy Multilayer Material <MCL> |
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High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
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Features |
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Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
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High heat resistance after water absorption compared to conventional FR-4. |
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Elastic modulus at high temperature is higher than conventional FR-4. |
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CTE is lower than conventional FR-4. |
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High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
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TG is 140 to 150 oC, which is higher than conventional FR-4. |
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DK & Df vs frequency and temperature is stable. |
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Low Dissipation Factor, High Heat Resistance Multilayer aterial |
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Low Transmission Loss Material |
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Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
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Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
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Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Low Press Temperature, Adhesive Film (AS-2600) |
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Printed Wiring Boards |
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Advanced Performance Products |
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Products Category List |
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Products Alphabetical List |
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HOME |
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Hitachi Chemical. Co, Ltd. |
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