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Electronics-Related
Materials |
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MCL-BE-67G(H) E GEA-67BE(H) <prepreg> |
inquiry |
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Semiconductor-Related |
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"Green Multilayer material ""Type
No. MCL-BE-67G(H)"" has achieved the UL94V-0 level of flammability, by developing
an original thermosetting resin that has excellent anti-flammability property
without using any compounds which includes halogen, antimony, or red phosphorus.
This material has good heat resistance and high elastic modulus at high
temperature, and low CTE. So it is advantageous for the soldering process
at the high temperature lead-free solder, and it is suitable for high density
interconnection technology." |
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Display
& Optics-Related |
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Base
Materials for PWBs |
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Glass
Epoxy Multilayer Material |
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Halogen
Free Multilayer Material |
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High
Tg Glass Epoxy Multilayer |
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Material |
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High
Elastic Modulus, Low CTE |
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Glass
Epoxy Multilayer Material |
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Low
CTE, High Tg Glasses |
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Epoxy
Multilayer Material |
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Features |
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Halogen
Free, High Elastic |
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High heat resistance after water absorption compared to conventional FR-4. |
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Modulus,
Low CTE Multilayer |
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Elastic modulus at high temperature is higher than conventional FR-4. |
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Material |
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CTE is lower than conventional FR-4. |
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Low
Dissipitation Factor, High |
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TG is 140 to 150 oC, which is higher than conventional FR-4. |
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Heat
Resistance Multilayer |
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DK & Df vs frequency and temperature is stable. |
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Material |
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Low
Transimission Loss Material |
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Glass
Epoxy Copper Clad |
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Laminate
(FR-4) |
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High
Anti-Tracking Glass Epoxy |
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Copper
Clad Laminate |
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High
Anti-Tracking Composite |
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Copper
Clad Laminate |
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Low
Pressure, Adhesive Film |
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AS-2600 |
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Printed
Wiring Boards |
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Advanced Performance Products |
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Products
Category List |
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Products
Alphabetical List |
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HOME |
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Hitachi
Chemical. Co, Ltd. |
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