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   electronics-related products>>base materials for PWBs    
               Electronics-Related Materials
  MCL-BE-67G(H) E GEA-67BE(H) <prepreg> inquiry   Semiconductor-Related
    "Green Multilayer material ""Type No. MCL-BE-67G(H)"" has achieved the UL94V-0 level of flammability, by developing an original thermosetting resin that has excellent anti-flammability property without using any compounds which includes halogen, antimony, or red phosphorus.
This material has good heat resistance and high elastic modulus at high temperature, and low CTE. So it is advantageous for the soldering process at the high temperature lead-free solder, and it is suitable for high density interconnection technology."
  Display & Optics-Related
      Base Materials for PWBs
       Glass Epoxy Multilayer Material
       Halogen Free Multilayer Material
       High Tg Glass Epoxy Multilayer
           Material
       High Elastic Modulus, Low CTE
            Glass Epoxy Multilayer Material
         Low CTE, High Tg Glasses
             Epoxy Multilayer Material
    Features      Halogen Free, High Elastic
  High heat resistance after water absorption compared to conventional FR-4.          Modulus, Low CTE Multilayer
  Elastic modulus at high temperature is higher than conventional FR-4.          Material
  CTE is lower than conventional FR-4.      Low Dissipitation Factor, High
  TG is 140 to 150 oC, which is higher than conventional FR-4.         Heat Resistance Multilayer
  DK & Df vs frequency and temperature is stable.         Material
         Low Transimission Loss Material
         Glass Epoxy Copper Clad
            Laminate (FR-4)
         High Anti-Tracking Glass Epoxy
            Copper Clad Laminate
         High Anti-Tracking Composite
            Copper Clad Laminate
         Low Pressure, Adhesive Film
            AS-2600
      Printed Wiring Boards
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