Hitachi Chemical Co. America, Ltd. [base materials for PWBs]

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			Electronics-Related Materials
MCL-E-679 ・ GEA-679N <prepreg>		inquiry	Semiconductor-Related
	These FR-5 equivalent materials offer increased Tg (175 TMA) and improved through-hole reliability. minimal water absorption rates of less than 50% of conventional FR-4s, these materials use advanced resin technology to offer superior CAF restraining property and better It is suitable for the substrate of plastic BGA.		Display & Optics-Related
			Base Materials for PWBs
			Glass Epoxy Multilayer Material
			Halogen Free Multilayer Material
			High Tg Glass Epoxy Multilayer
			Material
			High Elastic Modulus, Low CTE
			Glass Epoxy Multilayer Material
Features			Low CTE, High Tg Glasses
High Tg & excellent through hole reliability			Epoxy Multilayer Material
Superior moisture resistance and good insulation resistance			Halogen Free, High Elastic
High heat resistance after water absorption			Modulus, Low CTE Multilayer
Good processability(for drilling punching)			Material
			Low Dissipitation Factor, High
			Heat Resistance Multilayer
			Material
			Low Transimission Loss Material
			Glass Epoxy Copper Clad
			Laminate (FR-4)
			High Anti-Tracking Glass Epoxy
			Copper Clad Laminate
			High Anti-Tracking Composite
			Copper Clad Laminate
			Low Pressure, Adhesive Film
			AS-2600
			Printed Wiring Boards
			Chemical-Related Materials
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