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Electronics-Related
Materials |
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 MCL-E-679
・ GEA-679N <prepreg> |
inquiry |
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 Semiconductor-Related |
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These FR-5 equivalent materials
offer increased Tg (175 TMA) and improved through-hole reliability. minimal
water absorption rates of less than 50% of conventional FR-4s, these materials
use advanced resin technology to offer superior CAF restraining property
and better It is suitable for the substrate of plastic BGA. |
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Display
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Base
Materials for PWBs |
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 Glass Epoxy Multilayer Material |
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Halogen Free Multilayer Material |
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High Heat Resistance Multilayer Material (FR-4) |
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 High Tg Glass Epoxy Multilayer Material <MCL> |
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Features |
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High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
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High Tg & excellent through hole reliability |
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Superior moisture resistance and good insulation resistance |
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Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
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High heat resistance after water absorption |
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Good processability(for drilling punching) |
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High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
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Low Dissipation Factor, High Heat Resistance Multilayer aterial |
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Low Transmission Loss Material |
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Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
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Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
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Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Low Press Temperature, Adhesive Film (AS-2600) |
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Printed Wiring Boards |
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Advanced Performance Products |
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Products Category List |
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Products Alphabetical List |
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HOME |
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Hitachi Chemical. Co, Ltd. |
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