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Electronics-Related
Materials |
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MCL-E-679F ・ GEA-679F <prepreg> |
inquiry |
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 Semiconductor-Related |
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"Type No. MCL-E-679F is high
elastic modulus and low CTE materials. (20% lower of CTE compared to conventional
FR-4.) And it has the properties for higher elasticity, higher barcol hardness.
The warpage is very low, and it is suitable for the substrates of plastic
memory card, memory module boards, base core material for build-up PWB,
and LCD's driver boards." |
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Display
& Optics-Related |
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Base
Materials for PWBs |
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 Glass
Epoxy Multilayer Material |
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Halogen
Free Multilayer Material |
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High
Tg Glass Epoxy Multilayer |
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Material |
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 High
Elastic Modulus, Low CTE |
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Glass Epoxy Multilayer
Material |
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Features |
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Low
CTE, High Tg Glasses |
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Less than 20% CTE(X,Y) and 50% (Z) compared to conventional FR-4 |
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Epoxy
Multilayer Material |
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Higher elasticity and barcol hardness compared to conventional FR-4 |
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Halogen
Free, High Elastic |
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Surface smoothness is less than 75% compared to conventional FR-4 |
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Modulus,
Low CTE Multilayer |
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Small warpage at heating |
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Material |
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Low
Dissipitation Factor, High |
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Heat
Resistance Multilayer |
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Material |
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Low
Transimission Loss Material |
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Glass
Epoxy Copper Clad |
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Laminate
(FR-4) |
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Hight
Anti-Tracking Glass Epoxy |
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Copper
Clad Laminate |
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Hight
Anti-Tracking Composite |
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Copper
Clad Laminate |
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Low
Pressure, Adhesive Film |
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AS-2600 |
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Printed
Wiring Boards |
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Advanced Performance Products |
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Products
Category List |
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Products
Alphabetical List |
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HOME |
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Hitachi
Chemical. Co, Ltd. |
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hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America
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