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Electronics-Related
Materials |
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MCL-E-679F(R) ・ GEA-679F(R) <prepreg> |
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 Semiconductor-Related |
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"Type No. MCL-E-679F is high
elastic modulus and low CTE materials. (20% lower of CTE compared to conventional
FR-4.) And it has the properties for higher elasticity, higher barcol hardness.
The warpage is very low, and it is suitable for the substrates of plastic
BGA, memory card, memory module boards, base core material for build-up PWB,
and LCD's driver boards." |
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Display
& Optics-Related |
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Base
Materials for PWBs |
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 Glass
Epoxy Multilayer Material |
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Halogen
Free Multilayer Material |
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High Heat Resistance Multilayer Material (FR-4) |
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High Tg Glass Epoxy Multilayer Material <MCL> |
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Features |
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 High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
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The coefficient of thermal expansion is about 20% (in the X and Y-directions) and about
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50% (in the Z-direction) lower than that of our standard FR-4.
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Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
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Elastic modulus is about 30% higher than that of our standard FR-4. Even thin laminate
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has less warpage and deflection.
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Superior heat resistance at PCT. |
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High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
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The surface roughness is about 1/4 that of our standard FR-4, making fine pattern possible. |
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Applications |
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Low Dissipation Factor, High Heat Resistance Multilayer aterial |
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Semiconductor packages. (FC-BGA, BGA, CSP) |
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Core material for HDI. |
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Low Transmission Loss Material |
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Characteristics |
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Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
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Thin Laminate |
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| Items |
Conditions |
Units |
Actual Values (t0.8mm) |
Test Method (IPC TM-650) |
| MCL-E-679F(R) |
| Dielectric Constant |
1MHz |
C-96/20/65 |
-- |
4.8 ~ 5.0 |
2.5.5.1 |
| Dissipation Factor |
1MHz |
C-96/20/65 |
-- |
0.0080 ~ 0.100 |
2.5.5.1 |
| Tg |
TMA |
°C |
160 ~ 170 |
2.4.24 |
| Flexural Modulus (Lengthwise) |
A |
GPa |
27 ~ 33 |
2.4.4 |
| CTE*1 |
X |
(30～120°C) |
ppm/°C |
12 ~ 14 |
2.4.24 |
| Y |
12 ~ 14 |
| Z |
(<Tg) |
20 ~ 30 |
| (>Tg) |
130 ~ 160 |
| Copper Peel Strength |
18μm |
A |
kN/m |
1.1 ~ 1.2 |
2.4.8 |
| Water Absorption |
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E-24/50+D-24/23 |
% |
0.03 ~ 0.05 |
2.6.2.1 |
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Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
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Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Low Press Temperature, Adhesive Film (AS-2600) |
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Printed Wiring Boards |
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Advanced Performance Products |
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Products Category List |
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Products Alphabetical List |
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*1): Heating Rate: 10°C/min. |
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HOME |
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Hitachi Chemical. Co, Ltd. |
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Prepreg |
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| Type |
Glass Cloth |
Properties |
| Style |
Weight
(g/m 2) |
Yarn Count (warpxfill) |
Resin Content
(%) |
Volatile Content
(%) |
Gelation Time (sec.) |
Dielectric Thickness after Lamination *1 (mm) |
| R Type |
0.04 |
FRZPE |
1037 |
24 |
69x72 |
73±2 |
<0.1 |
115±25 |
0.048 |
| 0.06 |
FREOE |
1078 |
48 |
53x53 |
68±2 |
110±25 |
0.078 |
| 0.1 |
FRSKE |
2116 |
104 |
60x58 |
58±2 |
<0.75 |
0.125 |
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*1) : The dielectric thickness after lamination is defined as the thickness of one sheet of |
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prepreg when the resin flow is within 5%. |
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This value changes according to the press condition and inner-layer pattern. |
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