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Electronics-Related
Materials |
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MCL-E-679(LD) ・ Type No.GEA-679N(LD) <prepreg> |
inquiry |
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 Semiconductor-Related |
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CTE of "Type No. MCL-E-679(LD)"
is lower (-30%), and elastic modulus is higher (+10%) than conventional
FR-4. Therefore, the multilayer boards composed by this products do not
bow when heated. It is suitable for memory module board, inner layer board
of build-up PWB, and especially for driver board of LCD. |
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Display
& Optics-Related |
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Base
Materials for PWBs |
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 Glass
Epoxy Multilayer Material |
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Halogen
Free Multilayer Material |
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High
Tg Glass Epoxy Multilayer |
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Material |
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High
Elastic Modulus, Low CTE |
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Glass
Epoxy Multilayer Material |
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Features |
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 Low
CTE, High Tg Glasses |
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Low CTE |
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Epoxy Multilayer
Material |
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(Less
than 30% of conventional FR-4) |
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Halogen
Free, High Elastic |
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High elastic modulus |
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Modulus,
Low CTE Multilayer |
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(More than 10% of conventional FR-4) |
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Material |
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Hi-Tg and good reliability |
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Low
Dissipitation Factor, High |
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Suitable for mounting TSOP, STCP |
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Heat
Resistance Multilayer |
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Law warpage and low twist at high heat processing conditions |
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Material |
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Low
Transimission Loss Material |
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Glass
Epoxy Copper Clad |
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Laminate
(FR-4) |
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Hight
Anti-Tracking Glass Epoxy |
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Copper
Clad Laminate |
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Hight
Anti-Tracking Composite |
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Copper
Clad Laminate |
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Low
Pressure, Adhesive Film |
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AS-2600 |
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Printed
Wiring Boards |
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Chemical-Related
Materials |
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Products
Category List |
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Products
Alphabetical List |
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HOME |
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Hitachi
Chemical. Co, Ltd. |
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