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Electronics-Related
Materials |
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MCL-E-679FG ・ GEA-679FG <prepreg> |
inquiry |
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 Semiconductor-Related |
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"Type no. MCL-E-679FG" has achieved
the UL94V-0 level of flammability without using any compound which includes
halogen, antimony red phosphorous. This material has high-Tg, high elastic
modulus and low CTE. So it is suitable for the substrates of plastic package,
LCD's driver boards, and high density interconnection and advantageous for
the soldering process at high temperature with lead free solder. |
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Display
& Optics-Related |
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Base
Materials for PWBs |
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 Glass
Epoxy Multilayer Material |
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Halogen
Free Multilayer Material |
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High
Tg Glass Epoxy Multilayer |
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Material |
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High
Elastic Modulus, Low CTE |
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Glass
Epoxy Multilayer Material |
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Features |
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Low
CTE, High Tg Glasses |
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Less than 50% CTE(Z) compared with that of conventional FR-4. |
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Epoxy
Multilayer Material |
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Higher elasticity and barcol hardness compared with that of conventional
FR-4. |
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 Halogen
Free, High Elastic |
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Excellent solder reflow property. (Suitable for lead-free solder.) |
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Modulus,
Low CTE Multilayer |
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Surface smoothness is less than 75% compared with that of conventional FR-4. |
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Material |
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Low
Dissipitation Factor, High |
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Heat
Resistance Multilayer |
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Material |
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Low
Transimission Loss Material |
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Glass
Epoxy Copper Clad |
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Laminate
(FR-4) |
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High
Anti-Tracking Glass Epoxy |
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Copper
Clad Laminate |
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High
Anti-Tracking Composite |
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Copper
Clad Laminate |
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Low
Pressure, Adhesive Film |
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AS-2600 |
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Printed
Wiring Boards |
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Advanced Performance Products |
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Products
Category List |
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Products
Alphabetical List |
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HOME |
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Hitachi
Chemical. Co, Ltd. |
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