| |
 MCL-E-679FG(R) ・FG(S), MCL-E-679FGB(S) <Black Type> |
|
|
Electronics-Related
Materials |
| |
GEA-679FG(R) ・ FG(S) <prepreg> |
inquiry |
|
 Semiconductor-Related |
| |
 |
|
"Type no. MCL-E-679FG" has achieved
the UL94V-0 level of flammability without using any compound which includes
halogen, antimony or red phosphorous. This material has high-Tg, high elastic
modulus and low CTE. So it is suitable for the substrates of plastic package,
LCD's driver boards, and high density interconnection and advantageous for
the soldering process at high temperature with lead free solder. |
|
Display
& Optics-Related |
| |
|
|
Base
Materials for PWBs |
| |
|
 Glass Epoxy Multilayer Material |
| |
|
Halogen Free Multilayer Material |
| |
|
High Heat Resistance Multilayer Material (FR-4) |
| |
|
| |
|
High Tg Glass Epoxy Multilayer Material <MCL> |
| |
|
|
|
|
|
| |
Features |
|
High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
| |
Halogen free material for environmental concerns.
|
|
| |
CTE (Z-direction) is about 50% lower than that of our standard FR-4.
|
|
Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
| |
Elastic modulus is about 20% higher than that of our standard FR-4. Even thin laminate
|
|
| |
has less warpage and deflection
|
|
| |
Superior heat resistance for soldering.(Suitable for the lead free process) |
|
High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
| |
Surface roughness is about 1/4 of our standard FR-4, and making fine pattern possible. |
|
| |
|
|
| |
Characteristics |
|
Low Dissipation Factor, High Heat Resistance Multilayer aterial |
| |
Thin Laminate |
|
| |
|
(t0.8m) |
|
| |
| Items |
Conditions |
Units |
FR-4 |
Test Method (IPC TM-650) |
| MCL-E-679FG(R) |
MCL-E-679FG(S) |
| Tg |
TMA |
°C |
163 ~ 173 |
175 ~ 185 |
2.4.24 |
| CTE*1 |
X |
(30 ~ 120
°C) |
ppm/
°C |
13 ~ 15 |
12 ~ 14 |
2.4.24 |
| Y |
13 ~ 15 |
12 ~ 14 |
| Z |
(<Tg) |
23 ~ 33 |
20 ~ 30 |
| (>Tg) |
140 ~ 170 |
130 ~ 160 |
Copper Peel Strength |
18μm |
A |
kN/m |
0.9 ~ 1.1 |
1.1 ~ 1.2 |
2.4.8 |
| Dielectric Constant |
1MHz |
C-96/20/65 |
-- |
5.2 ~ 5.4 |
5.0 ~ 5.2 |
2.5.5.1 |
| Dissipation Factor |
1MHz |
C-96/20/65 |
-- |
0.0080 ~ 0.0100 |
2.5.5.1 |
| Water Absorption |
|
E-24/50+D-24/23 |
% |
0.04 ~0.06 |
0.03 ~ 0.05 |
2.6.2.1 |
|
Low Transmission Loss Material |
| |
Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
| |
| |
| |
Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
| |
| |
| |
Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
| |
| |
| |
Glass Epoxy Copper Clad Laminate (FR-4) |
| |
| |
Low Press Temperature, Adhesive Film (AS-2600) |
| |
| |
Printed Wiring Boards |
| |
Advanced Performance Products |
| |
*1) : Heating Rate:10°C/min. |
|
Products Category List |
| |
|
|
Products Alphabetical List |
| |
Prepreg |
|
HOME |
| |
| Type |
Glass Cloth |
Properties |
| Style |
Weight (g/m2) |
Yarn Count (warpxfill) |
Resin Content
(%) |
Volatile Content
(%) |
Gelation Time (Sec.) |
Dielectric Thickness after Lamination*1(mm) |
| R Type |
0.04 |
GRZPE |
1037 |
24 |
69x72 |
73±2 |
<1.0 |
170±30 |
0.048 |
| 0.06 |
GRROE |
1078 |
48 |
53x53 |
68±2 |
170±30 |
0.078 |
| 0.1 |
GRSKE |
2116 |
104 |
60x58 |
58±2 |
<0.75 |
0.125 |
| S Type |
0.04 |
GSZPE |
1037 |
24 |
69x72 |
73±2 |
<1.0 |
170±30 |
0.048 |
| 0.06 |
GSROE |
1078 |
48 |
53x53 |
68±2 |
170±30 |
0.078 |
| 0.1 |
GSSKE |
2116 |
104 |
60x58 |
58±2 |
<0.75 |
0.125 |
| Test Method (IPC TM-650) |
|
2.3.16.1 |
2.3.19 |
2.3.18 |
-- |
|
Hitachi Chemical. Co, Ltd. |
| |
|
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
*1) : The dielectric thickness after lamination is defined as the thickness of one sheet of |
|
| |
prepreg when the resin flow is within 5%. |
|
| |
This value changes according to the press condition and inner-layer pattern. |
|
| |
|
|
| |
 |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
|
| |
 |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
 |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
|
|
hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America
Page
Top