| |
|
|
|
|
|
Electronics-Related
Materials |
| |
MCL-E-670 |
|
|
inquiry |
|
 Semiconductor-Related |
| |
 |
|
Type No. MCL-E-670 is a glass
epoxy FR-4 laminate with high CTI. It has low thermal expansion rate, and
excellent property of through-hole reliability. |
|
Display
& Optics-Related |
| |
|
|
Base
Materials for PWBs |
| |
|
 Glass
Epoxy Multilayer Material |
| |
|
Halogen
Free Multilayer Material |
| |
|
|
High
Tg Glass Epoxy Multilayer |
| |
|
|
Material |
| |
|
|
High
Elastic Modulus, Low CTE |
| |
|
|
|
|
|
Glass
Epoxy Multilayer Material |
| |
Features |
|
Low
CTE, High Tg Glasses |
| |
UL's highest grade for anti-tracking property (CTI 600V) |
|
Epoxy
Multilayer Material |
| |
Excellent long term heat aging property |
|
Halogen
Free, High Elastic |
| |
Good moisture-proof |
|
Modulus,
Low CTE Multilayer |
| |
Low thermal expansion property |
|
Material |
| |
|
|
Low
Dissipitation Factor, High |
| |
Applications |
|
Heat
Resistance Multilayer |
| |
Communication & measurement equipment, game equipment, power module,
air |
|
Material |
| |
conditioner, automotive, etc. |
|
Low
Transimission Loss Material |
| |
|
|
Glass
Epoxy Copper Clad |
| |
|
|
Laminate
(FR-4) |
| |
|
|
 High
Anti-Tracking Glass Epoxy |
| |
|
|
Copper Clad Laminate |
| |
|
|
Hight
Anti-Tracking Composite |
| |
|
|
Copper
Clad Laminate |
| |
|
|
Low
Pressure, Adhesive Film |
| |
|
|
AS-2600 |
| |
|
|
Printed
Wiring Boards |
| |
|
|
Advanced Performance Products |
| |
|
|
| |
|
|
Products
Category List |
| |
|
|
Products
Alphabetical List |
| |
|
|
HOME |
| |
|
|
Hitachi
Chemical. Co, Ltd. |
| |
|
|
.
|
| |
|
|
| |
|
|
|
hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America
Page
Top