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Electronics-Related Materials |
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 MCL-437G(N) |
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 Semiconductor-Related |
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Green Paper-phenolic copper clad laminates "Type No. MCL-437G(N)" is an environmental friendly material that has achieved the UL94V-0 level of flammability without using any compounds which includes halogen, antimony, or red phosphorus. Type No. MCL-437G(N) is low smell and the amounts of phenol, formaldehyde extraction are reduced. General properties and punchability are almost same as conventional FR-1. |
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Display & Optics-Related |
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Base Materials for PWBs |
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 Glass Epoxy Multilayer Material |
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Halogen Free Multilayer Material |
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High Tg Glass Epoxy Multilayer |
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Material |
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High Elastic Modulus, Low CTE |
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Glass Epoxy Multilayer Material |
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Low CTE, High Tg Glasses |
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Epoxy Multilayer Material |
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Halogen Free, High Elastic |
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Modulus, Low CTE Multilayer |
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Material |
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Low Dielectric Constant Multilayer |
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Material |
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High Dielectric Constant Multilayer |
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Material |
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Low Dissipitation Factor, High |
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Heat Resistance Multilayer |
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Material |
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Low Transimission Loss Material |
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Higher Elastic Modulus |
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Adhesive Film with Copper Foil |
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Halogen-Free Adhesive Sheet |
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Glass Epoxy Copper Clad |
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Laminate (FR-4) |
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Hight Anti-Tracking Glass Epoxy |
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Copper Clad Laminate |
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Hight Anti-Tracking Composite |
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Copper Clad Laminate |
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 Haloge
Free FR-1 |
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Low Pressure, Adhesive Film |
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AS-2500 |
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Low Pressure, Adhesive Film |
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AS-2600 |
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Thermal Conductive Adhesive Film |
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Thermal Conductive Low Elasticity |
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Adhesive Film |
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Printed Wiring Boards |
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Chemical-Related Materials |
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