Hitachi Chemical Co. America, Ltd. [base materials for PWBs]

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			Electronics-Related Materials
AS-2500		inquiry	Semiconductor-Related
	"Type No. AS-2500" can be laminated at low press temperature and low pressure condition. It is suitable for laminating to glass plates, ceramics etc. And it also can be used for adhering to heat-slug with IC packages etc.		Display & Optics-Related
			Base Materials for PWBs
			Glass Epoxy Multilayer Material
			Halogen Free Multilayer Material
			High Tg Glass Epoxy Multilayer
			Material
			High Elastic Modulus, Low CTE
			Glass Epoxy Multilayer Material
Features			Low CTE, High Tg Glasses
For heat lamination at low temperature and low pressure			Epoxy Multilayer Material
For hot roll lamination			Halogen Free, High Elastic
Superior adhesion strength and insulating resistance			Modulus, Low CTE Multilayer
Easy processing under B-stage			Material
			Low Dielectric Constant Multilayer
Applications			Material
For the adhesive film between ceramic boards			High Dielectric Constant Multilayer
For laminating IC package and heat-slug			Material
			Low Dissipitation Factor, High
			Heat Resistance Multilayer
			Material
			Low Transimission Loss Material
			Higher Elastic Modulus
			Adhesive Film with Copper Foil
			Halogen-Free Adhesive Sheet
			Glass Epoxy Copper Clad
			Laminate (FR-4)
			Hight Anti-Tracking Glass Epoxy
			Copper Clad Laminate
			Hight Anti-Tracking Composite
			Copper Clad Laminate
			Haloge Free FR-1
			Low Pressure, Adhesive Film
			AS-2500
			Low Pressure, Adhesive Film
			AS-2600
			Thermal Conductive Adhesive Film
			Thermal Conductive Low Elasticity
			Adhesive Film
			Printed Wiring Boards
			Advanced Performance Products
			Advanced Performance Products
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