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| electronics-related products>>base materials for PWBs |
| Electronics-Related Materials | ||||||
 AS-2600 |
inquiry |
 Semiconductor-Related |
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"Type No. AS-2600" can be laminated under low press temperature and low press conditions. It is suitable for lamination to polyimide film and other metal (ex. nickel). | Display
& Optics-Related |
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| Base
Materials for PWBs |
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 Glass
Epoxy Multilayer Material |
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| Halogen
Free Multilayer Material |
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| High
Tg Glass Epoxy Multilayer |
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| Material | ||||||
| High
Elastic Modulus, Low CTE |
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| Glass Epoxy Multilayer Material | ||||||
| Low
CTE, High Tg Glasses |
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| Epoxy Multilayer Material | ||||||
| Halogen
Free, High Elastic |
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| Modulus, Low CTE Multilayer | ||||||
| Material | ||||||
| Low
Dissipitation Factor, High |
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| Heat Resistance Multilayer | ||||||
| Material | ||||||
| Low
Transimission Loss Material |
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| Glass
Epoxy Copper Clad |
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| Laminate (FR-4) | ||||||
| High
Anti-Tracking Glass Epoxy |
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| Copper Clad Laminate | ||||||
| High
Anti-Tracking Composite |
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| Copper Clad Laminate | ||||||
 Low
Pressure, Adhesive Film |
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| AS-2600 | ||||||
| Printed
Wiring Boards |
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