Hitachi Chemical Co. America, Ltd. [base materials for PWBs]

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			Electronics-Related Materials
AS-2600		inquiry	Semiconductor-Related
	"Type No. AS-2600" can be laminated under low press temperature and low press conditions. It is suitable for lamination to polyimide film and other metal (ex. nickel).		Display & Optics-Related
			Base Materials for PWBs
			Glass Epoxy Multilayer Material
			Halogen Free Multilayer Material
			High Heat Resistance Multilayer Material (FR-4)

			High Tg Glass Epoxy Multilayer Material <MCL>

			High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material

			Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material


			High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL>


			Low Dissipation Factor, High Heat Resistance Multilayer aterial


			Low Transmission Loss Material
			Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL>



			Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL>


			Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL>


			Glass Epoxy Copper Clad Laminate (FR-4)

			Low Press Temperature, Adhesive Film (AS-2600)

			Printed Wiring Boards
			Advanced Performance Products

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