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Electronics-Related Materials |
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 GF-3500 |
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inquiry |
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 Semiconductor-Related |
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Type No. GF-3500 has high thermal conductivity and high reliability, including ceramic filler with B-stage epoxy resin and pliant resin.It is useful for PWB used with aluminum plate,mulitilayer (or double sided) PWB and for semiconductor package use. |
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Display & Optics-Related |
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Base Materials for PWBs |
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 Glass Epoxy Multilayer Material |
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Halogen Free Multilayer Material |
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High Tg Glass Epoxy Multilayer |
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Material |
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High Elastic Modulus, Low CTE |
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Glass Epoxy Multilayer Material |
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Features |
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Low CTE, High Tg Glasses |
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 Excellent thermal resistance property |
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Epoxy Multilayer Material |
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Good adhesive strength, insulation reliability |
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Halogen Free, High Elastic |
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Pre-lamination to aluminum plate |
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Modulus, Low CTE Multilayer |
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Material |
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Low Dielectric Constant Multilayer |
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Material |
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High Dielectric Constant Multilayer |
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Material |
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Low Dissipitation Factor, High |
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Heat Resistance Multilayer |
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Material |
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Low Transimission Loss Material |
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Higher Elastic Modulus |
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Adhesive Film with Copper Foil |
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Halogen-Free Adhesive Sheet |
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Glass Epoxy Copper Clad |
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Laminate (FR-4) |
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Hight Anti-Tracking Glass Epoxy |
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Copper Clad Laminate |
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Hight Anti-Tracking Composite |
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Copper Clad Laminate |
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Haloge Free FR-1 |
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Low Pressure, Adhesive Film |
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AS-2500 |
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Low Pressure, Adhesive Film |
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AS-2600 |
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 Thermal
Conductive Adhesive Film |
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Thermal Conductive Low Elasticity |
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Adhesive Film |
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Printed Wiring Boards |
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Advanced Performance Products |
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Products Category List |
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Products Alphabetical List |
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