Hitachi Chemical Co. America, Ltd. [base materials for PWBs]

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			Electronics-Related Materials
GF-3600		inquiry	Semiconductor-Related
	We have developed a new thermal conductive adhesive film which has low elasticity for heat lamination with materials of different CTE.		Display & Optics-Related
			Base Materials for PWBs
			Glass Epoxy Multilayer Material
			Halogen Free Multilayer Material
			High Tg Glass Epoxy Multilayer
			Material
			High Elastic Modulus, Low CTE
			Glass Epoxy Multilayer Material
Features			Low CTE, High Tg Glasses
Low modulus of elasticity.			Epoxy Multilayer Material
Low thermal resistance.			Halogen Free, High Elastic
			Modulus, Low CTE Multilayer
			Material
			Low Dielectric Constant Multilayer
			Material
			High Dielectric Constant Multilayer
			Material
			Low Dissipitation Factor, High
			Heat Resistance Multilayer
			Material
			Low Transimission Loss Material
			Higher Elastic Modulus
			Adhesive Film with Copper Foil
			Halogen-Free Adhesive Sheet
			Glass Epoxy Copper Clad
			Laminate (FR-4)
			Hight Anti-Tracking Glass Epoxy
			Copper Clad Laminate
			Hight Anti-Tracking Composite
			Copper Clad Laminate
			Haloge Free FR-1
			Low Pressure, Adhesive Film
			AS-2500
			Low Pressure, Adhesive Film
			AS-2600
			Thermal Conductive Adhesive Film
			Thermal Conductive Low Elasticity
			Adhesive Film
			Printed Wiring Boards
			Chemical-Related Materials
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