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Electronics-Related
Materials |
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 MCL-E-73 ・GEA-73N <prepreg> |
inquiry |
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 Semiconductor-Related |
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MCL-E-73 has superior heat resistance property, which is suitable for the lead free soldering process with lower CTE and excellent through-hole reliability. It is well suited to electronics for automobiles, personal computer, high density electronic equipment etc... |
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Display
& Optics-Related |
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Base
Materials for PWBs |
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 Glass Epoxy Multilayer Material |
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Halogen Free Multilayer Material |
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 High Heat Resistance Multilayer Material (FR-4) |
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High Tg Glass Epoxy Multilayer Material <MCL> |
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Features |
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High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
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Heat resistance is superior to that of our standard FR-4, and suitable for the lead free
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process.
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Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
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The coefficient of thermal expansion is lower than that of our standard FR-4 and that
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makes excellent through-hole reliability. |
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Suitable for punching process. |
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High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
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CAF restraining property is superior to that of our standard FR-4. |
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Characteristics |
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Low Dissipation Factor, High Heat Resistance Multilayer aterial |
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| Items |
Conditions |
Units |
Actual Values (t0.8mm) |
Test Method (IPC TM-650) |
| Tg |
TMA |
°C |
135 ~ 145 |
2.4.24 |
| CTE*1 |
X |
(30～120°C) |
ppm/°C |
12 ~ 15 |
2.4.24 |
| Y |
14 ~ 17 |
| Z |
(<Tg) |
35 ~ 45 |
| (>Tg) |
180 ~ 240 |
| Copper Peel Strength |
18μm |
A |
kN/m |
1.2 ~ 1.4 |
2.4.8 |
| Water Absorption |
E-24/50+D-24/23 |
% |
0.04 ~ 0.06 |
2.6.2.1 |
| CAF |
85°C/85%RH，100V |
Hrs. |
>1000 |
-- |
| Decomposition Temperature (5%Weight Loss) |
TGA |
°C |
340 ~ 360 |
2.3.40 |
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Low Transmission Loss Material |
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Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
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Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
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Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Low Press Temperature, Adhesive Film (AS-2600) |
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*1) : Heating Rate:10°C/min. |
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Printed Wiring Boards |
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Advanced Performance Products |
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