Hitachi Chemical Co. America, Ltd.

High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL>

MCL-E-679GT ・GEA-679GT <prepreg>

MCL-E679GT has halogen free, lower CTE and higher modulus, which is suitable for thin package as SiP and PoP application.

Features

  • MCL-E-679GT is effective for reducing warpage of thin PKG because of lower CTE (before and after Tg) and higher modulus.
  • By superior electrical properties, It is possible to reduce transmission loss.
  • Using copper profile, it is possible to make fine line by semiadditive process.
  • MCL-E-679GT has good drill processability and CAF restraining property to be adaptable for high density PKG.

Characteristics

Thin Laminate

Items Conditions Units Actual Values (t0.8mm) Test Method (IPC TM-650)
 Tg TMA °C 165 ~ 175 2.4.24
 CTE*1 X (30~120°C) ppm/°C 11 ~ 13 2.4.24
Y 11 ~ 13
Z (<Tg) 20 ~ 30
(>Tg) 110 ~ 140
 Copper Peel  Strength 18μm A kN/m 1.0 ~ 1.2 2.4.8
 Water Absorption E-24/50+D-24/23 % 0.04 ~ 0.06 2.6.2.1
 Flexural Modulus  (Lengthwise) A GPa 28 ~ 33 2.4.4
 Surface Resistance A μm 2 ~ 3 2.2.17
 Decomposition Temperature TGA °C 340 ~ 360 2.3.40

*1) : Heating Rate:10°C/min.