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Electronics-Related
Materials |
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 MCL-FX-2 ・GFA-2 <prepreg> |
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 Semiconductor-Related |
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Transmission loss in the GHz band can be reduced to about 50% of our standard FR-4. Standard glass fabric (E-glass) specification makes drilling and cutting workability as high as that of our standard FR-4. It is suitable for network applications, super computer, measuring equipment, high-frequency modules and antenna application. |
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Display
& Optics-Related |
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Base
Materials for PWBs |
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 Glass Epoxy Multilayer Material |
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Halogen Free Multilayer Material |
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High Heat Resistance Multilayer Material (FR-4) |
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High Tg Glass Epoxy Multilayer Material <MCL> |
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Features |
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High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
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Transmission loss in the GHz band can be reduced to about 50% of our standard FR-4.
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Dk and Df are small. |
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Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
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General-purpose glass fabric (E-glass) specification makes drilling and cutting
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workability as high as that of our standard FR-4. |
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High Tg, low water absorption and excellent heat resistance. |
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High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
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Characteristics |
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Thin Laminate |
Low Dissipation Factor, High Heat Resistance Multilayer aterial |
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| Items |
Conditions |
Units |
Actual Values (t0.8mm) |
Test Method (IPC TM-650) |
Dielectric Constant |
1MHz |
C-96/20/65 |
-- |
3.50 ~ 3.70 |
2.5.5.1 |
| 1Ghz*1 |
3.30 ~ 3.50 |
2.5.5.5 |
| 1Ghz*2 |
3.50 ~ 3.70 |
2.5.5.9 |
| Dissipation Factor |
1MHz |
C-96/20/65 |
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0.0005 ~ 0.0010 |
2.5.5.1 |
| 1Ghz*1 |
0.0020 ~ 0.0030 |
2.5.5.5 |
| 1Ghz*2 |
0.0010 ~ 0.0020 |
2.5.5.9 |
| Copper Peel Strength |
18μm (Low Profile) |
A |
kN/m |
0.4 ~ 0.7 |
2.4.8 |
| Tg |
TMA |
°C |
175 ~ 185 |
2.4.24 |
| Solder Heat Resistance (260°C) |
A |
Sec. |
> 300 |
-- |
| Water Absorption |
E-24/50+D-24/23 |
% |
0.03 ~ 0.04 |
2.6.2.1 |
| CAF |
85°C/85% RH, 100V |
Hrs. |
> 1000 |
-- |
| Flammability (UL-94) |
A |
-- |
V-0 Equivalent |
2.3.10 |
| Decomposition Temperature(5% Weight Loss) |
TGA |
°C |
350 ~ 370 |
2.3.40 |
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Low Transmission Loss Material |
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 Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
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Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
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Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Low Press Temperature, Adhesive Film (AS-2600) |
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Products Category List |
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Products Alphabetical List |
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HOME |
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Hitachi Chemical. Co, Ltd. |
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*1) : Measured by Triplate-line Resonator. |
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*2) : Measured by Material Analyzer. |
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