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Electronics-Related
Materials |
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 MCL-HE-679G ・GHA-679G <prepreg> |
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 Semiconductor-Related |
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MCL-HE-679G is halogen free and has good dielectric characteristic suitable for high frequency signals, and superior heat resistance for high layer count board. lt is suitable for network applications (router, server), and high frequency devices. |
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Display
& Optics-Related |
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Base
Materials for PWBs |
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 Glass Epoxy Multilayer Material |
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Halogen Free Multilayer Material |
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High Heat Resistance Multilayer Material (FR-4) |
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High Tg Glass Epoxy Multilayer Material <MCL> |
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High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
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Features |
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Dissipation factor is about 50% lower than that of our standard FR-4.
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Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
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High Tg and superior heat resistance for soldering. (Suitable for the lead free process) |
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The coefficient of thermal expansion in Z-direction is about 30% lower than that of our
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standard FR-4. |
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High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
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Environmentally friendly material. It achieved the UL 94-V-O level of flammability without |
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using any compound which includes halogen, antimony or red phosphorous. |
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Low Dissipation Factor, High Heat Resistance Multilayer aterial |
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Characteristics |
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Thin Laminate |
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Conditions |
Units |
Actual Values (t0.8mm) |
Test Method (IPC TM-650) |
Dielectric Constant |
1MHz |
C-96/20/65 |
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4.30 ~ 4.50 |
2.5.5.1 |
| 1Ghz*1 |
3.90 ~ 4.10 |
2.5.5.5 |
| 1Ghz*2 |
4.10 ~ 4.30 |
2.5.5.9 |
| Dissipation Factor |
1MHz |
C-96/20/65 |
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0.0060 ~ 0.0080 |
2.5.5.1 |
| 1Ghz*1 |
0.0080 ~ 0.0100 |
2.5.5.5 |
| 1Ghz*2 |
0.0070 ~ 0.0090 |
2.5.5.9 |
| Copper Peel Strength |
18μm |
A |
kN/m |
0.8 ~ 1.1 |
2.4.8 |
| Tg |
TMA |
°C |
180 ~ 190 |
2.4.24 |
| Solder Heat Resistance (260°C) |
A |
Sec. |
> 300 |
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| Water Absorption |
E-24/50+D-24/23 |
% |
0.03 ~ 0.04 |
2.6.2.1 |
| CAF |
85°C/85% RH, 100V |
Hrs. |
> 1000 |
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| Flammability (UL-94) |
A |
-- |
V-0 Equivalent |
2.3.10 |
| Decomposition Temperature(5% Weight Loss) |
TGA |
°C |
370 ~ 390 |
2.3.40 |
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Low Transmission Loss Material |
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Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
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 Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
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Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Low Press Temperature, Adhesive Film (AS-2600) |
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Printed Wiring Boards |
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Advanced Performance Products |
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Products Category List |
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Products Alphabetical List |
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HOME |
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Hitachi Chemical. Co, Ltd. |
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Hitachi Chemical. Co, Ltd. |
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*1) : Measured by Triplate-line Resonator. |
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*2) : Measured by Material Analyzer. |
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