Hitachi Chemical Co. America, Ltd.

Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL>

MCL-LZ-71G ・GZA-71G <prepreg>

MCL-LZ-71G is halogen free and has high heat resistance property for the lead-free soldering process, suitable for high-frequency application, network applications, base station, high speed modules, with its low transmission loss property.

Features

  • Transmission loss in the GHz band can be reduced to about 40% of our standard FR-4.
  • Halogen free material for environmental concerns.
  • General-purpose glass fabric (E-glass) specification makes drilling and cutting workability as high as that of our standard FR-4.
  • High Tg, low water absorption and excellent heat resistance.

Characteristics

Thin Laminate

Items Conditions Units Actual Values (t0.8mm) Test Method (IPC TM-650)

 Dielectric  Constant

 
1MHz C-96/20/65 -- 3.60 ~ 3.80 2.5.5.1
1Ghz*1 3.50 ~ 3.70 2.5.5.5
1Ghz*2 3.55 ~ 3.75 2.5.5.9
 Dissipation  Factor 1MHz C-96/20/65 -- 0.0030 ~ 0.0050 2.5.5.1
1Ghz*1 0.0050 ~ 0.0070 2.5.5.5
1Ghz*2 0.0035 ~ 0.0055 2.5.5.9
 Copper Peel  Strength 18μm A kN/m 0.6 ~ 1.0 2.4.8
 Tg TMA °C 165 ~ 175 2.4.24
 Solder Heat Resistance  (260°C) A Sec. > 300 --
 Water Absorption E-24/50+D-24/23 % 0.03 ~ 0.04 2.6.2.1
 CAF 85°C/85% RH, 100V Hrs. > 1000 --
 Flammability (UL-94) A -- V-0 Equivalent 2.3.10
 Decomposition  Temperature(5% Weight  Loss) TGA °C 350 ~ 370 2.3.40

*1) : Measured by Triplate-line Resonator.
*2) : Measured by Material Analyzer.