| |
|
|
|
Electronics-Related
Materials |
| |
 MCL-LZ-71G ・GZA-71G <prepreg> |
inquiry |
|
 Semiconductor-Related |
| |
 |
|
MCL-LZ-71G is halogen free and has high heat resistance property for the lead-free soldering process, suitable for high-frequency application, network applications, base station, high speed modules, with its low transmission loss property. |
|
Display
& Optics-Related |
| |
|
|
Base
Materials for PWBs |
| |
|
 Glass Epoxy Multilayer Material |
| |
|
Halogen Free Multilayer Material |
| |
|
High Heat Resistance Multilayer Material (FR-4) |
| |
|
| |
|
High Tg Glass Epoxy Multilayer Material <MCL> |
| |
|
|
| |
|
|
|
|
|
High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material |
| |
Features |
|
| |
Transmission loss in the GHz band can be reduced to about 40% of our standard FR-4.
|
|
Halogen Free, High Elastic Modulus, Low CTE Mulilayer Material |
| |
Halogen free material for environmental concerns. |
|
| |
General-purpose glass fabric (E-glass) specification makes drilling and cutting
|
|
| |
workability as high as that of our standard FR-4. |
|
High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL> |
| |
High Tg, low water absorption and excellent heat resistance. |
|
| |
|
|
| |
Characteristics |
|
Low Dissipation Factor, High Heat Resistance Multilayer aterial |
| |
Thin Laminate |
| |
| Items |
Conditions |
Units |
Actual Values (t0.8mm) |
Test Method (IPC TM-650) |
Dielectric Constant |
1MHz |
C-96/20/65 |
-- |
3.60 ~ 3.80 |
2.5.5.1 |
| 1Ghz*1 |
3.50 ~ 3.70 |
2.5.5.5 |
| 1Ghz*2 |
3.55 ~ 3.75 |
2.5.5.9 |
| Dissipation Factor |
1MHz |
C-96/20/65 |
-- |
0.0030 ~ 0.0050 |
2.5.5.1 |
| 1Ghz*1 |
0.0050 ~ 0.0070 |
2.5.5.5 |
| 1Ghz*2 |
0.0035 ~ 0.0055 |
2.5.5.9 |
| Copper Peel Strength |
18μm |
A |
kN/m |
0.6 ~ 1.0 |
2.4.8 |
| Tg |
TMA |
°C |
165 ~ 175 |
2.4.24 |
| Solder Heat Resistance (260°C) |
A |
Sec. |
> 300 |
-- |
| Water Absorption |
E-24/50+D-24/23 |
% |
0.03 ~ 0.04 |
2.6.2.1 |
| CAF |
85°C/85% RH, 100V |
Hrs. |
> 1000 |
-- |
| Flammability (UL-94) |
A |
-- |
V-0 Equivalent |
2.3.10 |
| Decomposition Temperature(5% Weight Loss) |
TGA |
°C |
350 ~ 370 |
2.3.40 |
|
| |
Low Transmission Loss Material |
| |
Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance MultilayerMaterial <MCL> |
| |
| |
| |
| |
Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL> |
| |
| |
| |
 Halegon Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL> |
| |
| |
| |
Glass Epoxy Copper Clad Laminate (FR-4) |
| |
| |
Low Press Temperature, Adhesive Film (AS-2600) |
| |
| |
Printed Wiring Boards |
| |
Advanced Performance Products |
| |
| |
Products Category List |
| |
Products Alphabetical List |
| |
HOME |
| |
Hitachi Chemical. Co, Ltd. |
| |
*1) : Measured by Triplate-line Resonator. |
|
|
| |
*2) : Measured by Material Analyzer. |
|
| |
|
|
| |
 |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
|
| |
 |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
|
| |
 |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
| |
|
|
| |
|
|
|
hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America
Page
Top