Hitachi Chemical Co. America, Ltd. [base materials for PWBs]

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			Electronics-Related Materials
Glass Epoxy Multilayer Material (FR-4)			Semiconductor-Related
MCL-E-67 ・GEA-67N <prepreg>		inquiry	Display & Optics-Related
	Type No. MCL-E-67 is a FR-4 multilayer material which has excellent properties of CAF as well as various electric and mechanical properties. This material is suitable for cellular phone, electric switching equipment, PCs and wide range of other applications.		Base Materials for PWBs
			Glass Epoxy Multilayer Material
			Halogen Free Multilayer Material
			High Tg Glass Epoxy Multilayer
			Material
			High Elastic Modulus, Low CTE
			Glass Epoxy Multilayer Material
			Low CTE, High Tg Glasses
Halogen Free Multilayer Material <MCL>			Epoxy Multilayer Material
MCL-BE-67G(H) ・ GEA-67BE(H) <prepreg>		inquiry	Halogen Free, High Elastic
	"Green Multilayer material ""Type No. MCL-BE-67G(H)"" has achieved the UL94V-0 level of flammability, by developing an original thermosetting resin that has excellent anti-flammability property without using any compounds which includes halogen, antimony, or red phosphorus. This material has good heat resistance and high elastic modulus at high temperature, and low CTE. So it is advantageous for the soldering process at the high temperature lead-free solder, and it is suitable for high density interconnection technology."		Modulus, Low CTE Multilayer
			Material
			Low Dissipitation Factor, High
			Heat Resistance Multilayer
			Material
			Low Transimission Loss Material
			Higher Elastic Modulus
			Glass Epoxy Copper Clad
			Laminate (FR-4)
			High Anti-Tracking Glass Epoxy
High Tg Glass Epoxy Multilayer Material <MCL>			Copper Clad Laminate
MCL-E-679 ・ GEA-679N <prepreg>		inquiry	High Anti-Tracking Composite
	These FR-5 equivalent materials offer increased Tg (175 TMA) and improved through-hole reliability. minimal water absorption rates of less than 50% of conventional FR-4s, these materials use advanced resin technology to offer superior CAF restraining property and better It is suitable for the substrate of plastic BGA.		Copper Clad Laminate
			Low Pressure, Adhesive Film
			AS-2600
			Printed Wiring Boards
			Chemical-Related Materials
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			Products Alphabetical List
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High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material <MCL>			Hitachi Chemical. Co, Ltd.
MCL-E-679F ・ GEA-679F <prepreg>		inquiry
	"Type No. MCL-E-679F is high elastic modulus and low CTE materials. (20% lower of CTE compared to conventional FR-4.) And it has the properties for higher elasticity, higher barcol hardness. The warpage is very low, and it is suitable for the substrates of plastic memory card, memory module boards, base core material for build-up PWB, and LCD's driver boards."







Low CTE, High Tg Glass Epoxy Multilayer Material <MCL>
MCL-E-679(LD) ・ Type No.GEA-679N(LD) <prepreg>		inquiry
	CTE of "Type No. MCL-E-679(LD)" is lower (-30%), and elastic modulus is higher (+10%) than conventional FR-4. Therefore, the multilayer boards composed by this products do not bow when heated. It is suitable for memory module board, inner layer board of build-up PWB, and especially for driver board of LCD.







Halogen Free, High Elastic Modulus, Low CTE Multilayer Material <MCL>
MCL-E-679FG ・ GEA-679FG <prepreg>		inquiry
	"Type no. MCL-E-679FG" has achieved the UL94V-0 level of flammability without using any compound which includes halogen, antimony red phosphorous. This material has high-Tg, high elastic modulus and low CTE. So it is suitable for the substrates of plastic package, LCD's driver boards, and high density interconnection and advantageous for the soldering process at high temperature with lead free solder.







Low Dissipitation Factor, High Heat Resistance Multilayer Material <MCL>
MCL-LX-67Y ・ GXA-67N <prepreg>		inquiry
	"Type No. MCL-LX-67Y" is high heat resistance multilayer material, which indicates low dielectric constant and low dissipation factor in GHz range of frequency, and also the processing characteristics are close to conventional FR-4. It is suitable for high frequency circuit board of cellular phone base station in the wireless communication market.







Low Transmission Loss Material <MCL>
MCL-LX-67F		inquiry
	"Type No.MCL-LX-67F" has low transmission loss that equals (a low dissipation factor) fluorine resin board(PTFE) and have a very excellent dielectric properties. Also, the processability of Type No.MCL-LX-67F does not require the type of treatment which is unique to the PTFE, thus can be processed using general FR-4 process. "Type No.MCL-LX-67F" is suitable for the antenna and converter PWB etc. of a high frequency band.







Glass Epoxy Copper Clad Laminate(FR-4)
MCL-E-67		inquiry
	Type No. MCL-E-67 is a FR-4 material for double sided PWBs, and has good properties as electric properties, surface smoothness, and dimensional stability. This material is suitable for office automation equipment, game machines, and electronics for automobiles.







High Anti-tracking Glass Epoxy Copper Clad Laminate
MCL-E-670		inquiry
	Type No. MCL-E-670 is a glass epoxy FR-4 laminate with high CTI. It has low thermal expansion rate, and excellent property of through-hole reliability.







High Anti-tracking Composite Copper Clad Laminate <MCL>
MCL-E-630		inquiry
	Type No. MCL-E-630 is a composite CEM-3 material with high CTI. It also have superior UV blocking property, and able to conduct double side exposure. Also have excellency in long-term termal reliability.







Low Press Temperature, Adhesive Film
AS-2600		inquiry
	"Type No. AS-2600" can be laminated under low press temperature and low press conditions. It is suitable for lamination to polyimide film and other metal (ex. nickel).








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