Hitachi Chemical Co. America, Ltd.

Base Materials for PWBs

Glass Epoxy Multilayer Material (FR-4)

MCL-E-67 ・GEA-67N <prepreg>

Type No. MCL-E-67 is a FR-4 multilayer material which has excellent properties of CAF as well as various electric and mechanical properties. This material is suitable for cellular phone, electric switching equipment, PCs and wide range of other applications.

Halogen Free Multilayer Material <MCL>

MCL-BE-67G(H) ・ GEA-67BE(H) <prepreg>

"Green Multilayer material ""Type No. MCL-BE-67G(H)"" has achieved the UL94V-0 level of flammability, by developing an original thermosetting resin that has excellent anti-flammability property without using any compounds which includes halogen, antimony, or red phosphorus.

This material has good heat resistance and high elastic modulus at high temperature, and low CTE. So it is advantageous for the soldering process at the high temperature lead-free solder, and it is suitable for high density interconnection technology."

High Heat Resistance Multilayer Material (FR-4)

MCL-E-73 ・ GEA-73N <prepreg>

MCL-E-73 has superior heat resistance property, which is suitable for the lead free soldering process with lower CTE and excellent through-hole reliability. It is well suited to electronics for automobiles, personal computer, high density electronic equipment etc...

High Tg Glass Epoxy Multilayer Material <MCL>

MCL-E-679 ・ GEA-679N <prepreg>

These FR-5 equivalent materials offer increased Tg (175 TMA) and improved through-hole reliability. minimal water absorption rates of less than 50% of conventional FR-4s, these materials use advanced resin technology to offer superior CAF restraining property and better It is suitable for the substrate of plastic BGA.

High Elastic Modulus, Low CTE Glass Epoxy Multilayer Material <MCL>

MCL-E-679F(R) ・ GEA-679F(R) <prepreg>

"Type No. MCL-E-679F is high elastic modulus and low CTE materials. (20% lower of CTE compared to conventional FR-4.) And it has the properties for higher elasticity, higher barcol hardness.

The warpage is very low, and it is suitable for the substrates of plastic memory card, memory module boards, base core material for build-up PWB, and LCD's driver boards."

Halogen Free, High Elastic Modulus, Low CTE Multilayer Material <MCL>

MCL-E-679FG(R) ・FG(S), MCL-E-679FGB(S) <Black Type>
GEA-679FG(R) ・ FG(S) <prepreg>

"Type no. MCL-E-679FG" has achieved the UL94V-0 level of flammability without using any compound which includes halogen, antimony red phosphorous. This material has high-Tg, high elastic modulus and low CTE. So it is suitable for the substrates of plastic package, LCD's driver boards, and high density interconnection and advantageous for the soldering process at high temperature with lead free solder.

High Elastic Modulus, Low CTE Multilayer Materials for Thin Package Substrates <MCL>

MCL-E-679GT ・ GEA-679GT <prepreg>

MCL-E679GT has halogen free, lower CTE and higher modulus, which is suitable for thin package as SiP and PoP application.

Low Dissipitation Factor, High Heat Resistance Multilayer Material <MCL>

MCL-LX-67Y ・ GXA-67N <prepreg>

"Type No. MCL-LX-67Y" is high heat resistance multilayer material, which indicates low dielectric constant and low dissipation factor in GHz range of frequency, and also the processing characteristics are close to conventional FR-4. It is suitable for high frequency circuit board of cellular phone base station in the wireless communication market.

Low Dielectric Constant, Low Dissipation Factor, High Heat Resistance Multilayer Material <MCL>

MCL-FX-2 ・ GFA-2 <prepreg>

Transmission loss in the GHz band can be reduced to about 50% of our standard FR-4. Standard glass fabric (E-glass) specification makes drilling and cutting workability as high as that of our standard FR-4. It is suitable for network applications, super computer, measuring equipment, high-frequency modules and antenna application.

Halogen Free, Low Dielectric Constant, High Heat Resistance Multilayer Material <MCL>

MCL-HE-679G ・ GHA-679G <prepreg>

MCL-HE-679G is halogen free and has good dielectric characteristic suitable for high frequency signals, and superior heat resistance for high layer count board. lt is suitable for network applications (router, server), and high frequency devices.

Halogen Free, Low Dielectric Constant, Low Dissipation Factor Multilayer Material <MCL>

MCL-LZ-71G ・ GEA-71G <prepreg>

MCL-LZ-71G is halogen free and has high heat resistance property for the lead-free soldering process, suitable for high-frequency application, network applications, base station, high speed modules, with its low transmission loss property.

Low Transmission Loss Material <MCL>

MCL-LX-67F

"Type No.MCL-LX-67F" has low transmission loss that equals (a low dissipation factor) fluorine resin board(PTFE) and have a very excellent dielectric properties. Also, the processability of Type No.MCL-LX-67F does not require the type of treatment which is unique to the PTFE, thus can be processed using general FR-4 process. "Type No.MCL-LX-67F" is suitable for the antenna and converter PWB etc. of a high frequency band.

Glass Epoxy Copper Clad Laminate (FR-4)

MCL-E-67

Type No. MCL-E-67 is a FR-4 material for double sided PWBs, and has good properties as electric properties, surface smoothness, and dimensional stability. This material is suitable for office automation equipment, game machines, and electronics for automobiles.

Low Press Temperature, Adhesive Film

AS-2600

"Type No. AS-2600" can be laminated under low press temperature and low press conditions. It is suitable for lamination to polyimide film and other metal (ex. nickel).