Hitachi Chemical Co. America, Ltd.

for COG

This type is available for microscopic bump of bare chip. It has excellent adhesion to glass and Si chip.

Features

  • Microscopic bump applicable
  • High adhesion and high reliability
  • Low contact resistance
  • Short bonding time
  • For low stress

Principle of connection

Applications

- Interconnection between LCD and driver IC

Characteristics (Typical Values)

Item Unit AC-8000 series
Application - for COG
 Fine pitch  capability  Min. contact area μm 2 1000
 Min. space μm 10
 Bonding  condition  Temp. °C 170~
 Time sec 5~
 Pressure PMa 50~150*