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 Electronics-Related
Materials |
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Electronics-Related Products
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 Semiconductor-Related |
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Display
& Optics-Related |
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Base
materials for PWBs |
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Printed
Wiring Boards |
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CMP Slurry |
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Glass Epoxy Multilayer Material (FR-4) |
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Advanced Performance Products |
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for STI |
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Halogen Free Multilayer Material |
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for Metal |
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High Tg Glass Epoxy Multilayer Material |
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Advanced Film Products |
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High Elastic Modulus, Low CTE Glass |
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Carbon & Ceramics |
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Die Bonding Paste |
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Epoxy Multilayer Material |
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Automotive-Related |
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for Lead Frame |
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Halogen Free, High Elastic Modulus, |
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Products Category List |
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for Substrate |
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Low CTE Multilayer Material |
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Products Alphabetical List |
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Low Dissipation Factor, High Heat |
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HOME |
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Die Bonding Film |
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Resistance Multilayer Material |
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Hitachi Chemical. Co, Ltd. |
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DF,HS Series |
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Low Transmission Loss Material |
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Dicing Die Bonding Film |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Underfill film |
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Low Press Temperature, Adhesive Film |
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(AS-2600) |
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Epoxy Molding Compounds |
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High Heat Resistance Multilayer Material |
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for Lead Frame |
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(FR-4) |
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for Substrate |
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High Elastic Modulus, Low CTE Multilayer |
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Environmentally Friendly Type |
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Materials for Thin Package Substrates |
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for Power Devices |
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<MCL> |
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Low Dielectric Constant, Low Dissipation |
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Liquid Encapsulants |
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Factor, High Heat Resistance Multilayer |
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CEL-C Series |
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Material <MCL> |
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Thermoplastic Type |
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Halogen Free, Low Dielectronic Constant, |
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High Heat Resistance Multilayer Material |
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Liquid Polyimides |
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<MCL> |
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HD MicroSystems, LLC. |
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Halogen Free, Low Dielectronic Constant, |
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Low Dissipation Factor Multilayer Material |
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High Heat Resistant Coating Materials |
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<MCL> |
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HL Series |
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for Screen Printing |
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LOC Tape |
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Package Substrate |
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HM Series |
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<High Density Build-up Multilayer Board> |
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Package Substrate <Cavity BGA> |
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Map Molding Support Tape |
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High Layer and Large Size PWB |
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RT Series |
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High Density Build-up Multilayer Board |
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High Density Multi-Wire Board |
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PWB for IC Testers |
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Test Fixture System for Logic IC |
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Anisotropic Conductive Film |
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for TAB |
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Capacitors |
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for COG |
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for Solderless Connective Film |
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Aluminum Electrolytic Capacitors |
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Screw Terminal Capacitors
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Transparent Conductive Transfer Film |
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Snap Mount Capacitors |
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MS series |
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Photo Flash Capacitors |
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Photosensitive Dry Film for Rib Patterning |
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Chip Niiobium Capacitors |
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MB series |
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Manganese Dioxide Capacitors
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Optical Clear Adhesive Materials "FINSET" |
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Chip Tantalum Capacitors |
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Film Type |
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High Performance Polymer Capacitors
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Liquid Type |
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Manganese Dioxide Capacitors |
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Plastic Film Capacitors |
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Chip Capacitors (PET, PPS, PEN)
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Resin Dip Capacitors (PET, PP, PPS) |
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Tape Wrapped Capacitors (PET, PP) |
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