| |
|
|
|
|
 Electronics-Related
Materials |
| |
Electronics-Related Products
|
|
 Semiconductor-Related |
| |
|
|
|
|
|
|
Display
& Optics-Related |
| |
|
|
|
|
Base
materials for PWBs |
| |
|
|
|
|
|
|
Printed
Wiring Boards |
| |
Interlayer Dielectric
Materials |
|
|
Glass Epoxy Multilayer Material (FR-4) |
|
Advanced Performance Products |
| |
|
HSG |
|
|
Halogen Free Multilayer Material |
|
| |
|
|
|
|
High Tg Glass Epoxy Multilayer Material |
|
Advanced Film Products |
| |
CMP Slurry |
|
|
High Elastic Modulus, Low CTR Glass |
|
Carbon & Ceramics |
| |
|
for STI |
|
|
Epoxy Multilayer Material |
|
Automotive-Related |
| |
|
for Metal |
|
|
Low CTE, High Tg Glass Epoxy Multilayer |
|
Products Category List |
| |
|
|
|
|
Material |
|
Products Alphabetical List |
| |
Die Bonding Paste |
|
|
Halogen Free, High Elastic Modulus, |
|
HOME |
| |
|
for Lead Frame |
|
|
Low CTE Multilayer Material |
|
Hitachi Chemical. Co, Ltd. |
| |
|
for Substrate |
|
|
Low Dissipation Factor, High Heat |
|
|
| |
|
|
|
|
Resistance Multilayer Material |
|
| |
Die Bonding Film |
|
|
Low Transmission Loss Material |
|
| |
|
DF,HS Series |
|
|
Glass Epoxy Copper Clad Laminate (FR-4) |
|
| |
|
Dicing Die Bonding Film
|
|
|
High Anti-tracking Glass Epoxy |
|
| |
|
Underfill film |
|
|
Copper Clad Laminate |
|
| |
|
|
|
|
High Anti-tracking Composite |
|
| |
Epoxy Molding Compounds |
|
|
Copper Clad Laminate |
|
| |
|
for Lead Frame |
|
|
Low Press Temperature, |
|
| |
|
for Substrate |
|
|
Adhesive Film (AS-2600) |
|
| |
|
Environmentally Friendly
Type |
|
|
|
|
| |
|
for Power Devices |
|
|
|
| |
|
|
|
|
|
|
| |
Liquid Encapsulants |
|
|
Package Substrate |
|
| |
|
CEL-C Series |
|
|
<High Density Build-up Multilayer Board> |
|
| |
|
Thermoplastic Type
|
|
|
Package Substrate <Cavity BGA> |
|
| |
|
|
|
|
High Layer and Large Size PWB |
|
| |
Liquid Polyimides |
|
|
High Density Build-up Multilayer Board |
|
| |
|
HD MicroSystems,
LLC. |
|
|
High Density Multi-Wire Board |
|
| |
|
|
|
PWB for IC Testers |
|
| |
High Heat Resistant Coating Materials |
|
|
Test Fixture System for Logic IC |
|
| |
|
HL Series |
|
|
|
|
| |
|
for Screen Printing |
|
Capacitors |
|
| |
|
|
|
|
|
| |
LOC Tape |
|
Aluminum Electrolytic Capacitors |
|
| |
|
HM Series |
|
|
Screw Terminal Capacitors
|
|
| |
|
|
|
|
Snap Mount Capacitors |
|
| |
Map Molding Support Tape |
|
|
Photo Flash Capacitors |
|
| |
|
RT Series |
|
|
|
|
| |
|
|
|
Chip Niiobium Capacitors |
|
| |
|
|
|
Manganese Dioxide Capacitors
|
|
| |
|
|
|
|
|
|
| |
Anisotropic Conductive Film |
|
Chip Tantalum Capacitors |
|
| |
|
for Display Interconnection and |
|
|
High Performance Polymer Capacitors
|
|
| |
|
Solder Substituion |
|
|
Manganese Dioxide Capacitors |
|
| |
|
|
|
|
|
|
| |
Transparent and Insulative Materials |
|
Plastic Film Capacitors |
|
| |
|
Photosensitive Post Spacer |
|
|
Chip Capacitors (PET, PPS, PEN)
|
|
| |
|
|
|
Resin Dip Capacitors (PET, PP, PPS) |
|
| |
Parts for Backlight Unit |
|
|
Tape Wrapped Capacitors (PET, PP) |
|
| |
|
Holographic Lightguide |
|
|
|
|
| |
|
|
|
|
|
|
| |
Optics Related Materials |
|
|
|
|
| |
|
Optical Polyimide Resin |
|
|
|
|
| |
|
Polymer Optical Waveguide |
|
|
|
|
| |
|
|
|
|
|
| |
|
|
|
|
|
|
| |
|
|
|
|
|
|
hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America
Page
Top