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Electronics-Related
Materials |
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 Semiconductor-Related |
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Display
& Optics-Related |
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Base
materials for PWBs |
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Printed
Wiring Boards |
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Interlayer Dielectric
Materials |
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Pressure Sensitive Adhesive
Film |
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Chemical-Related
Materials |
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HSG |
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Adhesive Film for Display
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Plastic
& Composite |
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Dicining Film |
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Carbon
& Ceramics |
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CMP Slurry |
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Masking Film for a Plating
Process |
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Automotive-Related |
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for STI |
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EMI Shielding Film |
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 Products
Category List |
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for Metal |
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Cross-linked foamed polyethylene |
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Products
Alphabetical List |
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Inorganic dense-packed
foam |
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HOME |
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Die Bonding Paste |
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Foamed polyethylene thermal
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Hitachi
Chemical. Co, Ltd. |
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for Lead Frame |
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insulation sleeve |
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for Substrate |
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Planar Anntena |
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Contactless IC Cards
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Die Bonding Film |
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DF,HS Series |
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Dicing Die Bonding Film
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Brushes for Automobile
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Underfill film |
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Brushes for Appliance and
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Power Tool Motors |
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Epoxy Molding Compounds |
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Brushes for Micro Motors
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for Lead Frame |
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Carbon Sliding Materials
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for Substrate |
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AnodeMaterial for Lithium
Ion Batteries |
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Environmentally Friendly
Type |
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Glass-like Carbon |
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for Power Devices |
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<HALOX> |
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<HALOX-Z> |
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Liquid Encapsulants |
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GSO Single Crystal Scintillator
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CEL-C Series |
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Thermoplastic Type
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Carbon Sliding Materials
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Liquid Polyimides |
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Protective film for automotive
body |
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HD MicroSystems,
LLC. |
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Brushes for Automobile
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Planar antenna for forward
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High Heat Resistant Coating Materials |
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looking radar system |
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HL Series |
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for Screen Printing |
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LOC Tape |
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HM Series |
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Map Molding Support Tape |
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RT Series |
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Anisotropic Conductive Film |
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for TCP, FPC |
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for COG |
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for COF |
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for PDP |
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Pigment Dispersed Colored Photoresist |
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for Transmissive LCD |
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for Reflective LCD |
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Transparent and Insulative Materials
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Photosensitive Post Spacer
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Parts for Backlight Unit |
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Holographic Lightguide
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Optics Related Materials |
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Optical Polyimide Resin
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Polymer Optical Waveguide
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Glass Epoxy Multilayer
Material (FR-4) |
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Halogen Free Multilayer
Material |
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High Tg Glass Epoxy Multilayer
Material |
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High Elastic Modulus, Low
CTE Glass |
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Epoxy Multilayer Material |
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Low CTE, High Tg Glass
Epoxy Multilayer |
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Material |
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Halogen Free, High Elastic
Modulus, |
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Low CTE Multilayer Material
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Low Dissipation Factor,
High Heat |
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Resistance Multilayer Material
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Low Transmission Loss Material
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Glass Epoxy Copper Clad
Laminate (FR-4) |
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High Anti-tracking Glass
Epoxy |
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Copper Clad Laminate |
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High Anti-tracking Composite
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Copper Clad Laminate |
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Low Press Temperature,
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Adhesive Film (AS-2600)
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Package Substrate |
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<High Density Build-up
Multilayer Board> |
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Package Substrate <Cavity
BGA> |
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High Layer and Large Size
PWB |
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High Density Build-up
Multilayer Board |
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High Density Multi-Wire
Board |
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PWB for IC Testers |
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Test Fixture System for
Logic IC |
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hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America
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