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Electronics-Related Materials |
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 Semiconductor-Related |
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Display & Optics-Related |
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Base materials for PWBs |
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Printed Wiring Boards |
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Interlayer Dielectric Materials |
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Pressure Sensitive Adhesive Film |
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Capacitors |
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HSG |
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Adhesive Film for Display |
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Advanced Performance Products |
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Dicining Film |
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CMP Slurry |
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Masking Film for a Plating Process |
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Advanced Film Products |
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for STI |
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Cross-linked foamed polyethylene |
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Carbon & Ceramics |
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for Metal |
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Inorganic dense-packed foam |
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Automotive-Related |
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Foamed polyethylene thermal |
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 Products Category List |
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Die Bonding Paste |
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insulation sleeve |
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Products Alphabetical List |
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for Lead Frame |
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Contactless IC Cards |
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HOME |
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for Substrate |
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SPD Film "LCF-1103DHA" |
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Hitachi Chemical. Co, Ltd. |
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Die Bonding Film |
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DF,HS Series |
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Dicing Die Bonding Film |
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Brushes for Automobile |
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Underfill film |
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Brushes for Appliance and |
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Power Tool Motors |
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Epoxy Molding Compounds |
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Brushes for Micro Motors |
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for Lead Frame |
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Carbon Sliding Materials |
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for Substrate |
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AnodeMaterial for Lithium Ion Batteries |
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Environmentally Friendly Type |
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Glass-like Carbon |
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for Power Devices |
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<HALOX> |
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<HALOX-Z> |
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Liquid Encapsulants |
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GSO Single Crystal Scintillator |
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CEL-C Series |
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Silicon carbide (SiC) Ceramics |
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Thermoplastic Type |
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Liquid Polyimides |
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HD MicroSystems, LLC. |
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Carbon Sliding Materials |
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High Heat Resistant Coating Materials |
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Protective Film for Automotive Body |
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HL Series |
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Brushes for Automobile |
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for Screen Printing |
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Planar Antenna for Forward |
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Looking Radar System |
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LOC Tape |
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Planar Antenna |
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HM Series |
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Disc Brake Pads |
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Drum Brake Units |
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Map Molding Support Tape |
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RT Series |
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Anisotropic Conductive Film |
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For Display Interconnection and Solder |
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Substitution |
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Transparent and Insulative Materials |
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Photosensitive Post Spacer |
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Parts for Backlight Unit |
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Holographic Lightguide |
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Glass Epoxy Multilayer Material (FR-4) |
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Halogen Free Multilayer Material |
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High Heat Resistance Multilayer Material |
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(FR-4) |
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High Tg Glass Epoxy Multilayer Material |
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High Elastic Modulus, Low CTE Glass |
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Epoxy Multilayer Material |
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Halogen Free, High Elastic Modulus, |
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Low CTE Multilayer Material |
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High Elastic Modulus, Low CTE Multilayer |
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Materials for Thin Package Substrates |
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<MCL> |
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Low Dissipation Factor, High Heat |
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Resistance Multilayer Material |
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Low Transmission Loss Material |
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Low Dielectric Constant, Low Dissipation |
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Factor, High Heat Resistance Multilayer |
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Material <MCL> |
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Halogen Free, Low Dielectronic Constant, |
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High Heat Resistance Multilayer Material |
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<MCL> |
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Halogen Free, Low Dielectronic Constant, |
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Low Dissipation Factor Multilayer Material |
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<MCL> |
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Glass Epoxy Copper Clad Laminate (FR-4) |
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Low Press Temperature, Adhesive Film |
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(AS-2600) |
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Package Substrate |
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<High Density Build-up Multilayer Board> |
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Package Substrate <Cavity BGA> |
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High Layer and Large Size PWB |
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High Density Build-up Multilayer Board |
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High Density Multi-Wire Board |
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PWB for IC Testers |
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Test Fixture System for Logic IC |
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Double Sided Flexible PCB |
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Capacitors |
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Aluminum Electrolytic Capacitors |
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Screw Terminal Capacitors
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Snap Mount Capacitors |
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Photo Flash Capacitors |
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Plastic Film Capacitors |
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Chip Capacitors (PET, PPS, PEN)
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Resin Dip Capacitors (PET, PP, PPS) |
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Tape Wrapped Capacitors (PET, PP) |
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hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America
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