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Hitachi Chemical DuPont MicroSystems, LLC.
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Electronics-Related Materials
A
High Density Multi-Wire Board
Semiconductor-Related
High Elastic Modulus, Low CTE Glass
Display & Optics-Related
Adhesive Film for Display
Epoxy Multilayer Material
Base materials for PWBs
Anisotropic Conductive Film
High Heat Resistant Coating Materials
Printed Wiring Boards
(for COF)
High Heat Resistant Coating Materials
Chemical-Related Materials
Anisotropic Conductive Film
(for Screen Printing)
Plastic & Composite
(for COG)
High Layer and Large Size PWB
Carbon & Ceramics
Anisotropic Conductive Film
High Tg Glass Epoxy Multilayer Material
Automotive-Related
(for PDP)
Holographic Lightguide
Products Category List
Anisotropic Conductive Film
Products Alphabetical List
(for TCP, FPC)
I
HOME
AnodeMaterial for Lithium Ion Batteries
Hitachi Chemical. Co, Ltd.
Inorganic dense-packed foam
B
Interlayer Dielectric Material <HSG>
Brushes for Appliance and
L
Power Tool Motors
Brushes for Automobile
Liquid Polyimides
Brushes for Micro Motors
Liquid Encapsulant CEL-C Series
Liquid Encapsulant
C
Thermoplastic Type
LOC Tape <HM Series>
Carbon Sliding Materials
Low CTE, High Tg Glass Epoxy Multilayer
CMP Slurry for Meta
l
Material
CMP Slurry for STI
Low Dissipation Factor, High Heat
Contactless IC Cards
Resistance Multilayer Material
Cross-linked foamed polyethylene
Low Press Temperature,
Adhesive Film (AS-2600)
D
Low Transmission Loss Material
Dicing Film
M
Dicing Die Bonding Film
Die Bonding Film for DF,HS Series
Map Molding Support Tape <RT Series>
Die Bonding Paste for Lead Frame
Masking Film for a Plating Process
Die Bonding Paste for Substrate
P
E
Package Substrate <Cavity BGA>
EMI Shielding Film
Package Substrate
Epoxy Molding Compound
<High Density Build-up Multilayer Board>
Environmentally Friendly Type
Pigment Dispersed Colored Photoresist
Epoxy Molding Compound
for Reflective LCD
for Lead Frame
Pigment Dispersed Colored Photoresist
Epoxy Molding Compound
for Transmissive LCD
for Power Devices
Planar Anntena
Epoxy Molding Compound
Planar antenna for forward
for Substrate
looking radar system
Pressure Sensitive Adhesive Film
F
Protective film for automotive body
PWB for IC Testers
Foamed polyethylene thermal
insulation sleeve
T
G
Test Fixture System for Logic IC
Transparent and Insulative Materials
Glass Epoxy Copper Clad Laminate (FR-4)
Glass Epoxy Multilayer Material (FR-4)
U
Glass-like Carbon
GSO Single Crystal Scintillator
Underfill film
H
Halogen Free, High Elastic Modulus,
Low CTE Multilayer Material
Halogen Free Multilayer Material
<HALOX>
<HALOX-Z>
High Anti-tracking Composite
Copper Clad Laminate
High Anti-tracking Glass Epoxy
Copper Clad Laminate
High Density Build-up Multilayer Board
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