Hitachi Chemical Co. America, Ltd. [products]

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				Electronics-Related Materials
A			High Density Multi-Wire Board	Semiconductor-Related
			High Elastic Modulus, Low CTE Glass	Display & Optics-Related
	Adhesive Film for Display		Epoxy Multilayer Material	Base materials for PWBs
	Anisotropic Conductive Film for Dispplay		High Heat Resistant Coating Materials	Printed Wiring Boards
	Interconnection and Solder Substitution		High Heat Resistant Coating Materials	Capacitors
	AnodeMaterial for Lithium Ion Batteries		(for Screen Printing)	Advanced Performance Products
			High Layer and Large Size PWB	Advanced Performance Products
B			High Tg Glass Epoxy Multilayer Material	Advanced Film Products
			Holographic Lightguide	Carbon & Ceramics
	Brushes for Appliance and			Automotive-Related
	Power Tool Motors	I		Products Category List
	Brushes for Automobile			Products Alphabetical List
	Brushes for Micro Motors		Inorganic dense-packed foam	HOME
			Interlayer Dielectric Material <HSG>	Hitachi Chemical. Co, Ltd.
C
		L
	Carbon Sliding Materials
	CMP Slurry for Metal		Liquid Polyimides
	CMP Slurry for STI		Liquid Encapsulant CEL-C Series
	Contactless IC Cards		Liquid Encapsulant
	Cross-linked foamed polyethylene		Thermoplastic Type
	Capacitors		LOC Tape <HM Series>
			Low CTE, High Tg Glass Epoxy Multilayer
D			Material
			Low Dissipation Factor, High Heat
	Dicing Film		Resistance Multilayer Material
	Dicing Die Bonding Film		Low Press Temperature,
	Die Bonding Film for DF,HS Series		Adhesive Film (AS-2600)
	Die Bonding Paste for Lead Frame		Low Transmission Loss Material
	Die Bonding Paste for Substrate
	Disc Brake Pads	M
	Drum Brake Units
	Double Sided Flexible PCB		Map Molding Support Tape <RT Series>
			Masking Film for a Plating Process
E
		P
	Epoxy Molding Compound
	Environmentally Friendly Type		Package Substrate <Cavity BGA>
	Epoxy Molding Compound		Package Substrate
	for Lead Frame		<High Density Build-up Multilayer Board>
	Epoxy Molding Compound		Planar Anntena
	for Power Devices		Planar Antenna for Forward
	Epoxy Molding Compound		Looking Radar System
	for Substrate		Pressure Sensitive Adhesive Film
			Protective film for automotive body
F			PWB for IC Testers

	Foamed Polyethylene Thermal	S
	Insulation Sleeve
			Silicon Carbide (SiC) Ceramics
G			SPD Film "LCF-1103DHA"

	Glass Epoxy Copper Clad Laminate (FR-4)	T
	Glass Epoxy Multilayer Material (FR-4)
	Glass-like Carbon		Test Fixture System for Logic IC
	GSO Single Crystal Scintillator		Transparent and Insulative Materials

H		U

	Halogen Free, High Elastic Modulus,		Underfill Film
	Low CTE Multilayer Material
	Halogen Free Multilayer Material
	<HALOX>
	<HALOX-Z>
	High Anti-tracking Composite
	Copper Clad Laminate
	High Anti-tracking Glass Epoxy
	Copper Clad Laminate
	High Density Build-up Multilayer Board
	High Performance Polymer Capacitors




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