Hitachi Chemical Co. America, Ltd. [products]

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				Electronics-Related Materials
A			Halogen Free, Low Dielectronic Constant,	Semiconductor-Related
			High Heat Resistance Multilayer Material	Display & Optics-Related
	Adhesive Film for Display		<MCL>	Base materials for PWBs
	Anisotropic Conductive Film for Dispplay		Halogen Free, Low Dielectronic Constant,	Printed Wiring Boards
	Interconnection and Solder Substitution		Low Dissipation Factor Multilayer Material	Capacitors
	AnodeMaterial for Lithium Ion Batteries		<MCL>	Advanced Performance Products
			High Density Multi-Wire Board	Advanced Performance Products
B			High Elastic Modulus, Low CTE Glass	Advanced Film Products
			Epoxy Multilayer Material	Carbon & Ceramics
	Brushes for Appliance and		High Heat Resistant Coating Materials	Automotive-Related
	Power Tool Motors		High Heat Resistant Coating Materials	Products Category List
	Brushes for Automobile		(for Screen Printing)	Products Alphabetical List
	Brushes for Micro Motors		High Layer and Large Size PWB	HOME
			High Tg Glass Epoxy Multilayer Material	Hitachi Chemical. Co, Ltd.
C			Holographic Lightguide

	Carbon Sliding Materials	I
	CMP Slurry for Metal
	CMP Slurry for STI		Inorganic dense-packed foam
	Contactless IC Cards		Interlayer Dielectric Material <HSG>
	Cross-linked foamed polyethylene
	Capacitors	L

D			Liquid Polyimides
			Liquid Encapsulant CEL-C Series
	Dicing Film		Liquid Encapsulant
	Dicing Die Bonding Film		Thermoplastic Type
	Die Bonding Film for DF,HS Series		LOC Tape <HM Series>
	Die Bonding Paste for Lead Frame		Low Dielectric Constant, Low Dissipation
	Die Bonding Paste for Substrate		Factor, High Heat Resistance Multilayer
	Disc Brake Pads		Material <MCL>
	Drum Brake Units		Low Dissipation Factor, High Heat
	Double Sided Flexible PCB		Resistance Multilayer Material
			Low Press Temperature,
E			Adhesive Film (AS-2600)
			Low Transmission Loss Material
	Epoxy Molding Compound
	Environmentally Friendly Type	M
	Epoxy Molding Compound
	for Lead Frame		Map Molding Support Tape <RT Series>
	Epoxy Molding Compound		Masking Film for a Plating Process
	for Power Devices
	Epoxy Molding Compound	P
	for Substrate
			Package Substrate <Cavity BGA>
F			Package Substrate
			<High Density Build-up Multilayer Board>
	Foamed Polyethylene Thermal		Planar Anntena
	Insulation Sleeve		Planar Antenna for Forward
			Looking Radar System
G			Pressure Sensitive Adhesive Film
			Protective film for automotive body
	Glass Epoxy Copper Clad Laminate (FR-4)		PWB for IC Testers
	Glass Epoxy Multilayer Material (FR-4)
	Glass-like Carbon	S
	GSO Single Crystal Scintillator
			Silicon Carbide (SiC) Ceramics
H			SPD Film "LCF-1103DHA"

	Halogen Free, High Elastic Modulus,	T
	Low CTE Multilayer Material
	Halogen Free Multilayer Material		Test Fixture System for Logic IC
	<HALOX>		Transparent and Insulative Materials
	<HALOX-Z>
	High Density Build-up Multilayer Board	U
	High Heat Resistance Multilayer Material
	(FR-4)		Underfill Film
	High Elastic Modulus, Low CTE Multilayer
	Materials for Thin Package Substrates
	<MCL>



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