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         Electronics-Related Materials
     A   High Density Multi-Wire Board   Semiconductor-Related
        High Elastic Modulus, Low CTE Glass   Display & Optics-Related
  Adhesive Film for Display     Epoxy Multilayer Material   Base materials for PWBs
  Anisotropic Conductive Film   High Heat Resistant Coating Materials   Printed Wiring Boards
    (for COF)   High Heat Resistant Coating Materials      Chemical-Related Materials
  Anisotropic Conductive Film     (for Screen Printing)   Plastic & Composite
    (for COG)   High Layer and Large Size PWB   Carbon & Ceramics
  Anisotropic Conductive Film   High Tg Glass Epoxy Multilayer Material   Automotive-Related
    (for PDP)   Holographic Lightguide      Products Category List
  Anisotropic Conductive Film         Products Alphabetical List
    (for TCP, FPC)      I      HOME
  AnodeMaterial for Lithium Ion Batteries            Hitachi Chemical. Co, Ltd.
        Inorganic dense-packed foam    
     B    Interlayer Dielectric Material <HSG>  
             
  Brushes for Appliance and      L  
    Power Tool Motors        
  Brushes for Automobile   Liquid Polyimides  
  Brushes for Micro Motors   Liquid Encapsulant CEL-C Series  
        Liquid Encapsulant  
     C     Thermoplastic Type  
        LOC Tape <HM Series>  
  Carbon Sliding Materials   Low CTE, High Tg Glass Epoxy Multilayer  
  CMP Slurry for Metal     Material  
  CMP Slurry for STI   Low Dissipation Factor, High Heat  
  Contactless IC Cards     Resistance Multilayer Material  
  Cross-linked foamed polyethylene   Low Press Temperature,  
          Adhesive Film (AS-2600)  
     D   Low Transmission Loss Material  
             
  Dicing Film      M  
  Dicing Die Bonding Film        
  Die Bonding Film for DF,HS Series   Map Molding Support Tape <RT Series>  
  Die Bonding Paste for Lead Frame   Masking Film for a Plating Process  
  Die Bonding Paste for Substrate        
           P  
     E        
        Package Substrate <Cavity BGA>  
  EMI Shielding Film   Package Substrate  
  Epoxy Molding Compound     <High Density Build-up Multilayer Board>  
    Environmentally Friendly Type   Pigment Dispersed Colored Photoresist  
  Epoxy Molding Compound     for Reflective LCD  
    for Lead Frame   Pigment Dispersed Colored Photoresist  
  Epoxy Molding Compound     for Transmissive LCD  
    for Power Devices   Planar Anntena  
  Epoxy Molding Compound   Planar antenna for forward  
    for Substrate     looking radar system  
        Pressure Sensitive Adhesive Film  
     F   Protective film for automotive body  
        PWB for IC Testers  
  Foamed polyethylene thermal        
    insulation sleeve      T  
             
     G   Test Fixture System for Logic IC  
        Transparent and Insulative Materials  
  Glass Epoxy Copper Clad Laminate (FR-4)        
  Glass Epoxy Multilayer Material (FR-4)      U  
  Glass-like Carbon        
  GSO Single Crystal Scintillator   Underfill film  
             
     H        
             
  Halogen Free, High Elastic Modulus,        
    Low CTE Multilayer Material        
  Halogen Free Multilayer Material        
  <HALOX>        
  <HALOX-Z>        
  High Anti-tracking Composite        
    Copper Clad Laminate        
  High Anti-tracking Glass Epoxy        
    Copper Clad Laminate        
  High Density Build-up Multilayer Board        
             
             
             
   
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