Hitachi Chemical Co. America, Ltd.

Film for Semiconductor Related Product

HAE Series

Dicing film is an adhesive tape to hold and protect semiconductor wafers from the dicing process to the pickup process. Especially this stretchable film improves the efficiency in the pickup process. Various grades are available to suit the cutting method and the chip size.

RM Series

Release sheet reduces the flash burr in molding of QFN packages etc.

Features

  • Various choice of adhesive strength. We are ready to serve a lot of kinds of film and the adhesion strength for various purposes.
  • Good at expanding.
  • Adhesion type and no UV treatment required.
  • Little contamination to a wafer.

Application

  • Holding the tips of wafer from dicing process to the pick up process.

Standard Specification

HAE-1500 series

Item Unit HAE-1525 HAE-1503L HAE-1503 HAE-1503H HAE-1504 HAE-1505 HAE-1506
 Standard adhesion gf/25mn 35 40 50 58 80 130 250
 Dimension  Thickness μm 80
 Width mm 150
 Length m 100
 Hue of film -  
 Material of film - PVC
 Material of separator - PAPER
 Properties  of  machine  Tensile  strength kgf/cm2 260
 Elongation % 260
 Elastic  modulus kgf/mm2 5.4
 50%  modulus kgf/cm 0.7
 Size of chips - large<>small

Note : Standard adhesion means an adhesion to the adherend for which SUS430-BA plate used,and was measured at an exfoliation angle of 90° an exfoliation speed of 200 mm/min and a temperature of 23°C. Unless otherwise specially indicated, the data are those measured under the same conditions as above.

HAE-1600 series

Item Unit HAE-1625 HAE-1603L HAE-1603 HAE-1603H HAE-1604 HAE-1605 HAE-1606
 Standard adhesion gf/25mn 35 40 50 58 80 130 250
 Dimension  Thickness μm 80
 Width mm 150
 Length m 100
 Hue of film -  
 Material of film - PVC
 Material of separator - OPP film
 Properties  of  machine  Tensile  strength kgf/cm2 260
 Elongation % 260
 Elastic  modulus kgf/mm2 5.4
 50%  modulus kgf/cm 0.7
 Size of chips - large<>small

Note : Standard adhesion means an adhesion to the adherend for which SUS430-BA plate used,and was measured at an exfoliation angle of 90° an exfoliation speed of 200 mm/min and a temperature of 23°C. Unless otherwise specially indicated, the data are those measured under the same conditions as above.

Release Sheet RM-4100

Features

  • RM-4100 is suitable for the general sheet type molding machine.
  • Flat and fine surface is produced by using RM-4100 because the shape of sheets is very stable in the molding process. RM-4100 is tough to wrinkle and the change of the shape by clamping pressure is also small.
  • The particular release layer holds lead frames and terminals tightly to prevent the invasion of epoxy molding compound, and the incidence of the flash burr is dramatically decreased.

Charateristics

Item Unit RM-4100
 Structure - Release layer
Base Film
 Thickness mm 0.04
 Tensile strength PMa 40
 Tensile elongation % 50
 Width mm 50~300
 Length m 100
 Product - Roll (Diameter: Approx. 12cm)

Molding Process

Loading RM-4100 and lead frame with chips on mold machine
 
Transferring mold resin into cavities after closing and clamping the molds tightly.
 
Opening the molds and removing the molded lead frame.

* The above datasheet is a sample observation value under certain testing conditions, not guaranteed performance.