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   chemical related products>>plastic products & composite materials    
               Electronics-Related Materials
  HAE Series     inquiry      Chemical-Related Materials
    Dicing film is an adhesive sheet and tape to fix semiconductor wafers. Various grades are available to suit the cutting method and the chip size.   Plastic & Composite
         Pressure Sensitive Adhesive Film
       Adhesive Film For Display
      Dicing Film
         Masking Film for a Plating Process
          EMI Shielding Film
         Cross-linked foamed polyethylene
               Inorganic dense-packed foam
   Features      Foamed polyethylene thermal
  Various choice of adhesive strength. We are ready to serve a lot of kinds of film and the          insulation sleeve
          adhesion strength for various purposes.      Planar Anntena
  Good at expanding.      Contactless IC Cards
  Adhesion type and no UV treatment required.   Carbon & Ceramics
  Little contamination to a wafer.   Automotive-Related
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   Application      Products Alphabetical List
  Holding the tips of wafer from dicing process to the pick up process.      HOME
         Hitachi Chemical. Co, Ltd.