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| electronics-related products>>printed wiring boards |
| Electronics-Related Materials | ||||||
 <High Density Build-up Multilayer Board> |
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 Semiconductor-Related |
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By utilizing proprietary technologies of ultra fine line wiring and electroless gold plating, we can make high density PWBs. Also, we can contribute to the thin layer formation with varieties of material selection. | Display & Optics-Related |
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| Base materials for PWBs |
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| Printed Wiring Boards |
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 Package
Substrate <High Density |
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| Build-up Multilayer Board> | ||||||
 Package Substrate <Cavity BGA> |
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| High Layer and Large Size PWB |
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| High Density Build-up Multilayer |
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| Features | Board <HITAVIA> | |||||
 Line/Space=25/25ƒÊm is possible. |
High Density Multi-Wire Board |
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| Top width 45ƒÊm is kept in 100ƒÊm pitch. |
PWB for IC Testers |
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| Material selection such as low elastic modulus, high heat resistance and halogen-free is |
Test Fixture System for Logic IC |
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| possible. | Chemical-Related Materials | |||||
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