Hitachi Chemical Co. America, Ltd.

Package Substrate <High Density Build-up Multilayer Board>

By utilizing proprietary technologies of ultra fine line wiring and electroless gold plating, we can make high density PWBs. Also, we can contribute to the thin layer formation with varieties of material selection.

Features

  • Line/Space=25/25μm is possible.
  • Top width 45μm is kept in 100μm pitch.
  • Material selection such as low elastic modulus, high heat resistance and halogen-free is possible.

Structure

Top View

Cross Selection