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| electronics-related products>>printed wiring boards |
| Electronics-Related Materials | ||||||
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 Semiconductor-Related |
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A multilayer board suitable for applications requiring higher density and increase in number of layers. This board is also applicable to large-size products. | Display & Optics-Related |
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| Base materials for PWBs |
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| Printed Wiring Boards |
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 Package Substrate <High Density |
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| Build-up Multilayer Board> | ||||||
| Package Substrate <Cavity BGA> |
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 High
Layer and Large Size PWB |
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| High Density Build-up Multilayer |
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| Features | Board <HITAVIA> | |||||
 Realize superior plating process of the through-holes with a high aspect ratio, by using |
High Density Multi-Wire Board |
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| our own electroless copper plating technology. | PWB for IC Testers |
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| Capable of producing large-sized products (1150×470 (mm) for 4-layer, 790×610 (mm) |
Test Fixture System for Logic IC |
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| for 6-layer or more) | Chemical-Related Materials | |||||
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