Hitachi Chemical Co. America, Ltd.

High Layer and Large Size PWB

A multilayer board suitable for applications requiring higher density and increase in number of layers. This board is also applicable to large-size products.

Features

  • Realize superior plating process of the through-holes with a high aspect ratio, by using our own electroless copper plating technology.
  • Capable of producing large-sized products (1150×470 (mm) for 4-layer, 790×610 (mm) for 6-layer or more)

Applications

  • Switching Equipment / Server / Back Plane