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| Electronics-Related Materials | ||||||
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 Semiconductor-Related |
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High Density Interconnection(HDI) Multilayer Board is using materials and processes developed on our own. As a product attaining both higher density and higher reliability, it is able to realize downsizing, weight reduction and functional improvement of electronic equipment. | Display & Optics-Related |
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| Base materials for PWBs |
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| Printed Wiring Boards |
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 Package Substrate <High Density Build-up Multilayer Board> |
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| Package Substrate <Cavity BGA> |
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| High Layer and Large Size PWB |
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 High
Density Build-up Multilayer Board <HITAVIA> |
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| Features | ||||||
 The stable production of the minimum line/space 75/75ƒÊm is possible because |
High Density Multi-Wire Board |
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| conductor thickness is uniform. | PWB for IC Testers |
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| By using our base materials, we can respond quickly to our customer needs by the |
Test Fixture System for Logic IC |
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| halogen-free property and the high frequency property. | Double Sided Flexible PCB |
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| Achieving high elastic modulus by using prepreg in build-up layers. |
Advanced Performance Products | |||||
| Cross Section of Multiple Layer IVH | Products Category List | |||||
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| Applicarions | ||||||
| Daughter Board for Base Station, Mother Board for Small Portable Devices, Mother |
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| Board with FBGA etc. | ||||||
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