Hitachi Chemical Co. America, Ltd.

High Density Build-up Multilayer Board <HITAVIA>

High Density Interconnection(HDI) Multilayer Board is using materials and processes developed on our own. As a product attaining both higher density and higher reliability, it is able to realize downsizing, weight reduction and functional improvement of electronic equipment.

Features

  • The stable production of the minimum line/space 75/75μm is possible because conductor thickness is uniform.
  • By using our base materials, we can respond quickly to our customer needs by the halogen-free property and the high frequency property.
  • Achieving high elastic modulus by using prepreg in build-up layers.

Cross Section of Multiple Layer IVH

Applications

  • Daughter Board for Base Station, Mother Board for Small Portable Devices, Mother Board with FBGA etc.