hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America| hitachi.com | hitachi.us | hitachi chemical co., ltd. | Hitachi Chemical DuPont MicroSystems, LLC. North America |
| | home | products | contact us | |
 |
 |
 |
|
| electronics-related products>>printed wiring boards |
| Electronics-Related Materials | ||||||
inquiry |
 Semiconductor-Related |
|||||
 |
High Density Interconnection(HDI) Multilayer Board is using materials and processes developed on our own. As a product attaining both higher density and higher reliability, it is able to realize downsizing, weight reduction and functional improvement of electronic equipment. | Display & Optics-Related |
||||
| Base materials for PWBs |
||||||
| Printed Wiring Boards |
||||||
 Package Substrate <High Density |
||||||
| Build-up Multilayer Board> | ||||||
| Package Substrate <Cavity BGA> |
||||||
| High Layer and Large Size PWB |
||||||
 High
Density Build-up Multilayer |
||||||
| Features | Board <HITAVIA> | |||||
 The stable production of the minimum line/space 75/75ƒÊm is possible because |
High Density Multi-Wire Board |
|||||
| conductor thickness is uniform. | PWB for IC Testers |
|||||
| By using our base materials, we can respond quickly to our customer needs by the |
Test Fixture System for Logic IC |
|||||
| halogen-free property and the high frequency property. | Chemical-Related Materials | |||||
| Achieving high elastic modulus by using prepreg in build-up layers. |
Products Category List | |||||
| Products Alphabetical List | ||||||
| Cross Section of Multiple Layer IVH | HOME | |||||
 |
Hitachi Chemical. Co, Ltd. | |||||
| Applicarions | ||||||
| Daughter Board for Base Station, Mother Board for Small Portable Devices, Mother |
||||||
| Board with FBGA etc. | ||||||
| Contact us | Terms of Use | Private Policy |
© Hitachi Chemical Co. America, Ltd. 2003. All rights reserved. |
Page Top