Hitachi Chemical Co. America, Ltd. [printed wiring boards]

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Realizing more flexible structure.

Features

Available for less than 100 μm at board thickness.

Desirable performance in bendability by using our original thermosetting solder resist.

Available for high density package by applying light stiffening film.

No need for plating lead by applying electroless Ni+Au plating.

Double Sided Flexible PCB

Item			Thin type	Double type	Light Stiffening	Fine Line Type
Base material	Polyimide base mateiral		Adhesiveless	Adhesiveless	Adhesiveless	Adhesiveless
	Solder resist	Side A	Light Stiffening	Light Stiffening Film	Light Stiffening	Light Stiffening
	Solder resist	Side B	Heat Stiffening	Light Stiffening Film	Cover-lay	Cover-lay
Pattern	Pattern Pitch (μm)		100	100	100	60
	Line width accuracy (μm)		±20	±20	±20	±10
	Pattern Pitch (μm)		120	120	120	120
Terminal	Top width accuracy (μm)		±30	±30	±30	±20
Terminal	Measurement accuracy (%)		±0.1	±0.1	±0.1	±0.08
Through-hole	Min. via dia. (ømm)		0.1	0.15	0.12	0.1
Surface finishing			Electroless Nickel / Gold Plating	Electroless Nickel / Gold Plating	Electroless Nickel / Gold Plating	Electroless Gold Plating

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Structure for Double Sided

Double Sided FPC with Sheild Layer

Developing FPC with Shield layer against EMI.

Item	Unit	3 Layer, 4 Layer Tpye
Base material	--	Adhesiveless Copper Clad Material ∙ Polyimide Cover-lay Film ∙ Conductive Cover-lay Film
No. of shield layer	Layer	1, 2
Resistance of shield layer	mΩ/	<300
Min. via dia of shield layer	ømm	2.4
Max. board thickness	mm	3 layers :0.16 4 layers :0.2
Min. line/space	μm	40/60
Min. via dia.	ømm	0.15
Surface finishing	--	Electroless Nickel / Gold Plating / Direct Gold Plating

Cross Section Structure