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| electronics-related products>>semiconductor-related materials |
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 HSG |
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 Semiconductor-Related |
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"HSG" is a new spin-on material (SOG) which is effective on high-speed devices with ULSI multilevel interconnections. It provides excellent properties: high mechanical strength and low water absorption. | Interlayer Dielectric Material | ||||
 <HSG> |
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| CMP Slurry | ||||||
 for STI |
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| for Metals |
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| Die Bonding Paste | ||||||
| for Lead Frame |
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| for Substrate |
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| Features | Die Bonding Film | |||||
 Low dielectric constant (≦2.5) with high modulus (≧4.0GPa) |
DF, HS Series |
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| High heat resistance (≧500oC) |
Dicing Die Bonding Film |
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| Narrow pore size distribution (≦0.2nm) |
Underfill Film |
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| Good process compatibility (etching, ashing and CMP) |
Epoxy Molding Compound | |||||
| for Lead Frame |
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| for Substrate |
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| Environmentally Friendly Type |
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| for Power Devices |
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| Liquid Encapsulants | ||||||
| CEL-C Series |
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| Thermoplastic Type |
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| High Heat Resistant Coating Material | ||||||
| HL Series |
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| for Screen Printing HL-P Series |
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| LOC Tape | ||||||
| HM Series |
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| Map Molding Support Tape | ||||||
| RT Series |
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| Display & Optics-Related |
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| Base Materials for PWBs |
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| Printed Wiring Boards |
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