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   electronics-related products>>semiconductor-related materials    
               Electronics-Related Materials
  HSG     inquiry   Semiconductor-Related
    "HSG" is a new spin-on material (SOG) which is effective on high-speed devices with ULSI multilevel interconnections. It provides excellent properties: high mechanical strength and low water absorption.     Interlayer Dielectric Material
      <HSG>
      CMP Slurry
       for STI
         for Metals
        Die Bonding Paste
         for Lead Frame
               for Substrate
    Features      Die Bonding Film
  Low dielectric constant (2.5) with high modulus (4.0GPa)      DF, HS Series
  High heat resistance (500oC)      Dicing Die Bonding Film
  Narrow pore size distribution (0.2nm)      Underfill Film
  Good process compatibility (etching, ashing and CMP)     Epoxy Molding Compound
         for Lead Frame
         for Substrate
         Environmentally Friendly Type
         for Power Devices
        Liquid Encapsulants
         CEL-C Series
         Thermoplastic Type
        High Heat Resistant Coating Material
         HL Series
         for Screen Printing HL-P Series
        LOC Tape
         HM Series
        Map Molding Support Tape
         RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
         Chemical-Related Materials
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         Products Alphabetical List
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