Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

for STI

inquiry

Semiconductor-Related

Hitachi Chemical is a leading company of CeO₂ slurry for STI. "GPX" shows excellent polishing performance and it is suitable for finer patterens.

Interlayer Dielectric Material

<HSG>

CMP Slurry

for STI

Die Bonding Paste

Features

Die Bonding Film

Free form scratches by using tuned CeO₂ particles.

DF, HS Series

High removal rate at low slurry content (CeO₂:1%).

Dicing Die Bonding Film

High planarization and selectivity between SiO₂ and Si₃N ₄.

Underfill Film

Unnecessary for conventional etch back process.

Epoxy Molding Compound

for Lead Frame

CMP Process

for Substrate

Environmentally Friendly Type

for Power Devices

Liquid Encapsulants

CEL-C Series

Thermoplastic Type

High Heat Resistant Coating Material

HL Series

for Screen Printing HL-P Series

LOC Tape

HM Series

Map Molding Support Tape

Advanced semiconductor devices with high performance are required to have multi-level

RT Series

layers, fine patterns to obtain high speed transmission. CMP process is indespensable to

Display & Optics-Related

have well-planarized interlayer dielectric or metals in LSI and accomplish the above

Base Materials for PWBs

requirments.

Printed Wiring Boards

Advanced Performance Products

Characteristics (Typical Values)

Item	Unit	HS-8005 series + HS-8102GP	HS-8005 series + HS-7303GP	HS-9000 series	SiO₂ slurry
Features	--	High planarization	Low scratch	Good workability	--
Supply form	--	2 components	2 components	1 component	1 component
Residual step height	nm	50	10	10	200
Automatic stop on Si₃N₄	--	Available	Available	Available	Available

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