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| electronics-related products>>semiconductor-related materials |
| Electronics-Related Materials | ||||||
 for STI |
inquiry |
 Semiconductor-Related |
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Hitachi Chemical is a leading company of C e O 2 slurry for STI. "GPX" is excellent for polishing and it is suitable for finer patterns. | Interlayer Dielectric Material | ||||
 <HSG> |
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| CMP Slurry | ||||||
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STI |
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| for Metals |
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| Die Bonding Paste | ||||||
| for Lead Frame |
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| for Substrate |
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| Features | Die Bonding Film | |||||
 Only a few scratches by using tuned C e O 2 particles |
DF, HS Series |
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| High removal rate at low slurry content (C e O 2 :1%) |
Dicing Die Bonding Film |
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| High selectivity between S i O 2 and S i 3 N 4 |
Underfill Film |
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| Obtainable an excellent flatness surface |
Epoxy Molding Compound | |||||
| Unnecessary for conventional etch back process |
for Lead Frame |
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| for Substrate |
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| Environmentally Friendly Type |
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| for Power Devices |
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| Liquid Encapsulants | ||||||
| CEL-C Series |
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| Thermoplastic Type |
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| High Heat Resistant Coating Material | ||||||
| HL Series |
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| for Screen Printing HL-P Series |
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| LOC Tape | ||||||
| HM Series |
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| Map Molding Support Tape | ||||||
| RT Series |
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| Display & Optics-Related |
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| Base Materials for PWBs |
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| Printed Wiring Boards |
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| Chemical-Related Materials | ||||||
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