Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

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Semiconductor-Related

"GPX" has two types: HS-C series for Cu and HS-T series for barrier metals. The polishing performance is controllable for various processes and devices.

Interlayer Dielectric Material

<HSG>

CMP Slurry

for STI

for Metals

Die Bonding Paste

for STI

for Lead Frame

for Substrate

Features

Die Bonding Film

High removal rate at low down force polishing.

DF, HS Series

Low dishing and erosion.

Dicing Die Bonding Film

Removal selectivity of Cu, TaN, and oxide is tunable.

Underfill Film

Epoxy Molding Compound

CMP Process

for Lead Frame

for Substrate

Environmentally Friendly Type

for Power Devices

Liquid Encapsulants

CEL-C Series

Thermoplastic Type

High Heat Resistant Coating Material

HL Series

for Screen Printing HL-P Series

LOC Tape

HM Series

Advanced semiconductor devices with high performance are required to have multi-level

Map Molding Support Tape

layers, fine patterns to obtain high speed transmission. CMP process is indespensable to

RT Series

have well-planarized interlayer dielectric or metals in LSI and accomplish the above

Display & Optics-Related

requirments.

Base Materials for PWBs

Printed Wiring Boards

Characteristics (Typical Values)

Advanced Performance Products

Item		Unit	HS-H635	HS-T605	HS-T815
Use		--	for Cu	for TaN
Features		--	Abrasive free like High removal @low down force	High selective	Non selective
Removal Rate	Cu	A/min.	8,000	250	480
	TaN		40	650	750
	SiO₂		--	<50	650
	SiOC		--	<50	200

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