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   electronics-related products>>semiconductor-related materials    
               Electronics-Related Materials
  for Metals     inquiry   Semiconductor-Related
    "GPX" has two types: HS-C series for Cu and HS-T series for barrier metals. The polishing performance is controllable for various processes and devices.     Interlayer Dielectric Material
       <HSG>
      CMP Slurry
         for STI
      for Metals
        Die Bonding Paste
  for STI      for Lead Frame
               for Substrate
    Features      Die Bonding Film
  High removal rate at low down force polishing.      DF, HS Series
  Low dishing and erosion.      Dicing Die Bonding Film
  Removal selectivity of Cu, TaN, and oxide is tunable.      Underfill Film
        Epoxy Molding Compound
    CMP Process      for Lead Frame
       for Substrate
       Environmentally Friendly Type
       for Power Devices
      Liquid Encapsulants
       CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
  Advanced semiconductor devices with high performance are required to have multi-level     Map Molding Support Tape
  layers, fine patterns to obtain high speed transmission. CMP process is indespensable to      RT Series
  have well-planarized interlayer dielectric or metals in LSI and accomplish the above   Display & Optics-Related
  requirments.   Base Materials for PWBs
      Printed Wiring Boards
    Characteristics (Typical Values)      Advanced Performance    Products
 
Item Unit HS-H635 HS-T605 HS-T815
 Use   -- for Cu for TaN
 Features   -- Abrasive free like High removal @low down force High selective Non selective
 Removal Rate  Cu A/min. 8,000 250 480
 TaN 40 650 750
 SiO2 -- <50 650
 SiOC -- <50 200
 
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