Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
for Lead Frame		inquiry	Semiconductor-Related
	" EPINAL" has been used as die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
		for Substrate	for Lead Frame
			for Substrate
Features			Die Bonding Film
Excellent workability to eliminate any problems of bonding layer.			DF, HS Series
Fast curability for high productivity.			Dicing Die Bonding Film
Low stress for low warpage and high reliability.			Underfill Film
High thermal conductivity.			Epoxy Molding Compound
			for Lead Frame
Process			for Substrate
			Environmentally Friendly Type
			for Power Devices
			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Advanced Performance Products
			Advanced Performance Products
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