Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
for Lead Frame		inquiry	Semiconductor-Related
	" EPINAL" has been used as die bonding adhesive for semiconductor devices. We have a top-level market share in die bonding paste.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features			Die Bonding Film
Superior heat resistance improves wire bondability and reduces chip			DF, HS Series
contamination during wire bonding process due to low outgassing			Dicing Die Bonding Film
Low stress paste minimizes the die warp and enhances the reliability of large chips.			Underfill Film
Good adhesion to various metal surfaces.			Epoxy Molding Compound
High thermal conductive paste partly replaces solder.			for Lead Frame
			for Substrate
			Environmentally Friendly Type
			for Power Devices
			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Chemical-Related Materials
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