Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
for Substrate		inquiry	Semiconductor-Related
	" EPINAL" has an excellent adhesion to various materials. The adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
		for Leadframe	for Lead Frame
			for Substrate
Features			Die Bonding Film
Superior heat resistance improves wire bondability and reduces chip contamination			DF, HS Series
during wire bonding process due to low outgassing.			Dicing Die Bonding Film
Low stress paste minimizes the die warp and enhances the reliability of large chips			Underfill Film
Excellent adhesion to solder resist			Epoxy Molding Compound
Less void and bleed			for Lead Frame
			for Substrate
Process			Environmentally Friendly Type
			for Power Devices
			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Advanced Performance Products
			Advanced Performance Products
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