Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

DF,HS Serires

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Semiconductor-Related

DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.

Interlayer Dielectric Material

<HSG>

CMP Slurry

for STI

for Metals

Dicing Die Bonding Film

Die Bonding Paste

Underfill Film

for Lead Frame

for Substrate

Features of DF Series

Die Bonding Film

Obtainable a uniform bonding layer without void.	Application
Excellent workability and storage stability.
Excellent reflow crack resistance.

DF, HS Series

Dicing Die Bonding Film

Underfill Film

Epoxy Molding Compound

for Lead Frame

for Substrate

Features of HS Series

Environmentally Friendly Type

Excellent stress reduction by low elastic modulus .	Application
Excellent gap filling capability of substrate.
Applicable for thicker film.

for Power Devices

Liquid Encapsulants

CEL-C Series

Thermoplastic Type

High Heat Resistant Coating Material

HL Series

Characteristics (Typical Values)

for Screen Printing HL-P Series

Item		Unit	DF-335-7	DF-402	DF-470	HS-270	Test method
Thickness		μm	25	15, 25, 40	15, 25, 40	12.5, 25, 50, 75, 100	--
Die bonding condition	Temp.	°C	230	180	150	120~160	--
Die bonding condition	Load	MPa	0.04	0.04	0.04	0.04	--
Tensile modulus (25°C)		MPa	2,600	2,400	2,400	1,000	DMA
Tg		°C	123	68	76	180	TMA
Die shear strength (260°C)		N/chip	>100	>100	>100	>100	5x5mm chip

LOC Tape

HM Series

Map Molding Support Tape

RT Series

Display & Optics-Related

Base Materials for PWBs

Printed Wiring Boards

Advanced Performance Products

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Process

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Hitachi Chemical. Co, Ltd.

Wafer backside lamination

Cut and lamination

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