Hitachi Chemical Co. America, Ltd.

DF,HS Series

DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.

Features of DF Series

  • Obtainable a uniform bonding layer without void.
  • Excellent workability and storage stability.
  • Excellent reflow crack resistance.

Features of HS Series

  • Excellent stress reduction by low elastic modulus.
  • Excellent gap filling capability of substrate.
  • Applicable for thicker film.

Characteristics (Typical Values)

Item Unit DF-335-7 DF-402 DF-470 HS-270 Test method
 Thickness μm 25 15, 25,
40
15, 25,
40
12.5, 25, 50, 75, 100 --

 Die bonding  condition

 Temp. °C  230 180 150 120~160 --
 Load MPa 0.04 0.04 0.04 0.04 --
 Tensile modulus (25°C) MPa 2,600 2,400 2,400 1,000 DMA
 Tg °C  123 68 76 180 TMA
 Die shear strength (260°C) N/chip >100 >100 >100 >100 5x5mm chip

Process


Wafer backside lamination


Cut and lamination