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| electronics-related products>>semiconductor-related materials |
| Electronics-Related Materials | ||||||
| DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process. | Interlayer Dielectric Material | |||||
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| CMP Slurry | ||||||
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| Die Bonding Paste | ||||||
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| Features of DF Series | Die Bonding Film | |||||
| bonding layer without void | |
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| and storage stability | Epoxy Molding Compound | |||||
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| resistance | |
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| Liquid Encapsulants | ||||||
| Features of HS Series | |
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| by low elastic modulus | High Heat Resistant Coating Material | |||||
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| among circuits | |
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| LOC Tape | ||||||
| PET support film, HS film | |
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| Map Molding Support Tape | ||||||
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