Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
DF,HS Serires		inquiry	Semiconductor-Related
	DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features of DF Series			Die Bonding Film
Obtainable an uniform			DF, HS Series
bonding layer without void			Dicing Die Bonding Film
Excellent workability			Underfill Film
and storage stability			Epoxy Molding Compound
High adhesive strength			for Lead Frame
Low water absorption			for Substrate
Excellent reflow crack			Environmentally Friendly Type
resistance			for Power Devices
			Liquid Encapsulants
Features of HS Series			CEL-C Series
Excellent stress reduction			Thermoplastic Type
by low elastic modulus			High Heat Resistant Coating Material
Excellent gap filling			HL Series
among circuits			for Screen Printing HL-P Series
Consisted of 3 layers:			LOC Tape
PET support film, HS film			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Chemical-Related Materials
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