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   electronics-related products>>semiconductor-related materials    
               Electronics-Related Materials
  Dicing Die Bonding Film FH Series inquiry   Semiconductor-Related
    FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer.

FH series is a co-developed product with
The Furukawa Electric Co., Ltd.
    Interlayer Dielectric Material
         <HSG>
      CMP Slurry
       for STI
       for Metals
      Die Bonding Paste
         for Lead Frame
               for Substrate
    Features      Die Bonding Film
  Lamination of dicing tape and      DF, HS Series
         die bonding film at one time   Dicing Die Bonding Film
  Excellent dicing and pick-up      Underfill Film
         performance     Epoxy Molding Compound
  Low lamination temperature          for Lead Frame
          to a wafer          for Substrate
  Excellent wire bondability          Environmentally Friendly Type
         without film curling          for Power Devices
  Excellent reflow crack resistance         Liquid Encapsulants
         CEL-C Series
         Thermoplastic Type
        High Heat Resistant Coating Material
         HL Series
         for Screen Printing HL-P Series
        LOC Tape
         HM Series
        Map Molding Support Tape
         RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
         Chemical-Related Materials
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         Products Alphabetical List
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