Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

Dicing Die Bonding Film FH Series

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Semiconductor-Related

FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it has achieved easy handling of thinner wafer.

FH series is a co-developed product with
The Furukawa Electric Co., Ltd.

Interlayer Dielectric Material

CMP Slurry

Die Bonding Paste

Underfill Film

Features

Die Bonding Film

Excellent dicing and pick-up performance.

DF, HS Series

Low lamination temperature to a wafer.

Dicing Die Bonding Film

Excellent wire bondability without film curling .

Underfill Film

Excellent reflow crack resistance

Epoxy Molding Compound

for Lead Frame

Characteristics (Typical Values)

for Substrate

Item			Unit	FH-800	FH-900	FH-9011	Test method
Adhesive thickness			μm	10, 20	10, 20, 25, 40	10, 20, 25, 40	--
DC tape properties	Exposure doze		mJ/cm²	150~400	150~400	150~400	--
	Adhesive strength between DCT and DBF	Before UV	N/25mm	1.4	1.4	1.4	--
	Adhesive strength between DCT and DBF	After UV	N/25mm	<0.1	<0.1	<0.1	--
Wafer laminating temp.			°C	60~90	60~90	60~80	--
Die bonding condition	Temp.		°C	100~160	100~160	100~160	--
Die bonding condition	Load		MPa	0.05~2.0	0.05~2.0	0.05~2.0	--
Elastic modulus (35c)			MPa	280	200	200	DMA
Tg			°C	165	180	180	TMA
Die shear strength (260C)			N/chip	>100	>100	>100	5x5mm chip