Hitachi Chemical Co. America, Ltd.

Dicing Die Bonding Film FH Series

FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it has achieved easy handling of thinner wafer.

FH series is a co-developed product with The Furukawa Electric Co., Ltd.

Features

  • Excellent dicing and pick-up performance.
  • Low lamination temperature to a wafer.
  • Excellent wire bondability without film curling.
  • Excellent reflow crack resistance.

Characteristics (Typical Values)

Item Unit FH-800 FH-900 FH-9011 Test method
 Adhesive thickness μm 10, 20 10, 20, 25, 40 10, 20, 25, 40 --
 DC tape  properties  Exposure doze mJ/cm2 150~400 150~400 150~400 --
 Adhesive  strength  between DCT  and DBF Before UV N/25mm 1.4 1.4 1.4 --
After UV N/25mm <0.1 <0.1 <0.1 --
 Wafer laminating temp. °C 60~90 60~90 60~80 --
 Die bonding  condition  Temp. °C 100~160 100~160 100~160 --
 Load MPa 0.05~2.0 0.05~2.0 0.05~2.0 --
 Elastic modulus (35c) MPa 280 200 200 DMA
 Tg °C 165 180 180 TMA
 Die shear strength (260C) N/chip >100 >100 >100 5x5mm chip

Process