Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
Dicing Die Bonding Film FH Series		inquiry	Semiconductor-Related
	FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer. FH series is a co-developed product with The Furukawa Electric Co., Ltd.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features			Die Bonding Film
Lamination of dicing tape and			DF, HS Series
die bonding film at one time			Dicing Die Bonding Film
Excellent dicing and pick-up			Underfill Film
performance			Epoxy Molding Compound
Low lamination temperature			for Lead Frame
to a wafer			for Substrate
Excellent wire bondability			Environmentally Friendly Type
without film curling			for Power Devices
Excellent reflow crack resistance			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Chemical-Related Materials
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