Electronics-Related Materials
Dicing Die Bonding Film FH Series
inquiry
Semiconductor-Related
FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it has achieved easy handling of thinner wafer.
FH series is a co-developed product with
The Furukawa Electric Co., Ltd.
Interlayer Dielectric Material
<HSG>
CMP Slurry
for STI
for Metals
Die Bonding Paste
DF, HS Series
for Lead Frame
Underfill Film
for Substrate
Features
Die Bonding Film
Excellent dicing and pick-up performance.
DF, HS Series
Low lamination temperature to a wafer.
Dicing
Die Bonding Film
Excellent wire bondability without film curling .
Underfill Film
Excellent reflow crack resistance
Epoxy Molding Compound
for Lead Frame
Characteristics (Typical Values)
for Substrate
Item
Unit
FH-800
FH-900
FH-9011
Test method
Adhesive thickness
μm
10, 20
10, 20, 25, 40
10, 20, 25, 40
--
DC tape properties
Exposure doze
mJ/cm2
150~400
150~400
150~400
--
Adhesive strength between DCT and DBF
Before UV
N/25mm
1.4
1.4
1.4
--
After UV
N/25mm
<0.1
<0.1
<0.1
--
Wafer laminating temp.
°C
60~90
60~90
60~80
--
Die bonding condition
Temp.
°C
100~160
100~160
100~160
--
Load
MPa
0.05~2.0
0.05~2.0
0.05~2.0
--
Elastic modulus (35c)
MPa
280
200
200
DMA
Tg
°C
165
180
180
TMA
Die shear strength (260C)
N/chip
>100
>100
>100
5x5mm chip
Environmentally Friendly Type
for Power Devices
Liquid Encapsulants
CEL-C Series
Thermoplastic Type
High Heat Resistant Coating Material
HL Series
for Screen Printing HL-P Series
LOC Tape
HM Series
Map Molding Support Tape
RT Series
Display & Optics-Related
Base Materials for PWBs
Printed Wiring Boards
Process
Advanced Performance Products
Products Category List
Products Alphabetical List
HOME
Hitachi Chemical. Co, Ltd.