Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

Underfill Film UF Series

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Semiconductor-Related

UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.

Interlayer Dielectric Material

<HSG>

CMP Slurry

for STI

for Metals

DF, HS Series

Die Bonding Paste

Dicing Die Bonding Film

for Lead Frame

for Substrate

Features

Die Bonding Film

Realizable fine pitch interconnection only with the application of heat and pressure .

DF, HS Series

Unnecessary for underfill.

Dicing Die Bonding Film

Stress reduction between a chip and a substrate.

Underfill Film

2 types are available: one with and one without conductive particles.

Epoxy Molding Compound

Structure

for Lead Frame

for Substrate

Environmentally Friendly Type

for Power Devices

Liquid Encapsulants

Characteristics (Typical Values)

CEL-C Series

Item		Unit	FC-212K	UF-536	Test method
Conductive particles		--	Included	None	--
Die bonding condition	Temp.	°C	180	180	--
	Load	MPa	1	1	--
	Time	s	20	20	--
Elastic modulus (40)		GPa	6.6	6.6	DMA
Tg		°C	172	172	DMA

Thermoplastic Type

High Heat Resistant Coating Material

HL Series

for Screen Printing HL-P Series

LOC Tape

HM Series

Map Molding Support Tape

RT Series

Display & Optics-Related

Process

Base Materials for PWBs

Printed Wiring Boards

Advanced Performance Products

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