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| electronics-related products>>semiconductor-related materials |
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| UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods. | Interlayer Dielectric Material | |||||
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| CMP Slurry | ||||||
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| Die Bonding Paste | ||||||
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| Features | Die Bonding Film | |||||
| Structure |
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| interconnection only with the | |
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| application of heat and pressure | ||||||
| Epoxy Molding Compound | ||||||
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| a chip and a substrate | |
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| Liquid Encapsulants | ||||||
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| High Heat Resistant Coating Material | ||||||
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| LOC Tape | ||||||
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| Map Molding Support Tape | ||||||
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