Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
Underfill Film UF Series		inquiry	Semiconductor-Related
	UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features			Die Bonding Film
Realizable fine pitch	Structure		DF, HS Series
interconnection only with the			Dicing Die Bonding Film
application of heat and pressure			Underfill Film
Unnecessary for underfill			Epoxy Molding Compound
Stress reduction between			for Lead Frame
a chip and a substrate			for Substrate
2 types are available: one with and one without conductive particles.			Environmentally Friendly Type
			for Power Devices
			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Chemical-Related Materials
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