Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

for Lead Frame

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Semiconductor-Related

Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.

Interlayer Dielectric Material

CMP Slurry

Die Bonding Paste

Features

Die Bonding Film

Excellent moisture resistance and heat shock resistance.

DF, HS Series

Excellent reflow crack resistance.

Dicing Die Bonding Film

Underfill Film

<Applications>

Epoxy Molding Compound

DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.

for Lead Frame

for Substrate

Environmentally Friendly Type

for Power Devices

Liquid Encapsulants

CEL-C Series

Process

Thermoplastic Type

High Heat Resistant Coating Material

HL Series

for Screen Printing HL-P Series

LOC Tape

HM Series

Map Molding Support Tape

Characteristics (Typical Values)

RT Series

Item		Unit	CEL-1620 HF16	CEL-1620 HF17	CEL-9200 HF10	CEL-9240 HF10	CEL-9200 HF9
Applications		--	DIP	DIP	QFP, SOP	QFN, PLCC	QFN
Flame retardant type		--	Metal hydroxide	Metal hydroxide	No flame retardant	No flame retardant	Organic phosphorous
Spiral flow		cm	120	80	100	100	110
Tg		°C	155	150	125	110	110
CTE	a1	ppm/°C	19	19	8	7	8
CTE	a2	ppm/°C	64	64	33	28	32
Flexural modulus		GPa	16	14	27	33	27
Mold shrinkage		%	0.45	0.55	0.17	0.16	0.22

Display & Optics-Related

Base Materials for PWBs

Printed Wiring Boards

Advanced Performance Products

Products Category List

Products Alphabetical List

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