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               Electronics-Related Materials
  for Lead Frame     inquiry   Semiconductor-Related
   

Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.

    CMP Slurry
         for STI
       for Metals
      Die Bonding Paste
         for Lead Frame
         for Substrate
  for Substrate      Die Bonding Film
               DF, HS Series
    Features      Dicing Die Bonding Film
  Excellent moisture resistance and heat shock resistance.      Underfill Film
  Excellent reflow crack resistance.     Epoxy Molding Compound
      for Lead Frame
      <Applications>      for Substrate
         DIP, SOP, TSOP, QFP, TQFP, LQFP and etc.      Environmentally Friendly Type
       for Power Devices
      Liquid Encapsulants
       CEL-C Series
       Thermoplastic Type
        High Heat Resistant Coating Material
    Process      HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
    Display & Optics-Related
    Characteristics (Typical Values)   Base Materials for PWBs
 
Item Unit CEL-1620 HF16 CEL-1620 HF17 CEL-9200 HF10 CEL-9240 HF10 CEL-9200
HF9
 Applications -- DIP DIP QFP, SOP QFN, PLCC QFN
 Flame retardant type -- Metal hydroxide Metal hydroxide No flame retardant No flame retardant Organic phosphorous
 Spiral flow cm 120 80 100 100 110
 Tg °C  155 150 125 110 110
 CTE  a1 ppm/°C  19 19 8 7 8
 a2 ppm/°C  64 64 33 28 32
 Flexural modulus GPa 16 14 27 33 27
 Mold shrinkage % 0.45 0.55 0.17 0.16 0.22
Printed Wiring Boards
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