Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

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Semiconductor-Related

This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.

Interlayer Dielectric Material

CMP Slurry

Die Bonding Paste

Features

Die Bonding Film

Small warpage after molding

DF, HS Series

Excellent reflow crack resistance

Dicing Die Bonding Film

Applicability to mold underfilling process

Underfill Film

Epoxy Molding Compound

<Applications>

for Lead Frame

CSP, BGA, Stacked MCP and etc.

for Substrate

Environmentally Friendly Type

for Power Devices

Liquid Encapsulants

CEL-C Series

Process

Thermoplastic Type

High Heat Resistant Coating Material

HL Series

for Screen Printing HL-P Series

LOC Tape

HM Series

Map Molding Support Tape

Characteristics (Typical Values)

RT Series

Item		Unit	CEL-1702 HF13	CEL-1802 HF19	CEL-9700 HF10	CEL-9750 HF10	CEL-9750 ZHF10
Applications		--	BOC	BOC	BGA, CSP
Flame retardant type		--	Metal hydroxide	Organic phosphorous	No flame retardant	No flame retardant	No flame retardant
Spiral flow		cm	90	90	110	145	150
Tg		°C	125	120	125	140	150
CTE	a1	ppm/°C	12	9	6	7	7
CTE	a2	ppm/°C	45	36	27	29	27
Flexural modulus		GPa	16	17	27	27	26
Mold shrinkage		%	0.32	0.35	0.10	0.10	0.08

Display & Optics-Related

Base Materials for PWBs

Printed Wiring Boards

Advanced Performance Products

Products Category List

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