Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

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Semiconductor-Related

This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.

CMP Slurry

Die Bonding Paste

Die Bonding Film

Features

Dicing Die Bonding Film

Small warpage after molding

Underfill Film

Excellent reflow crack resistance

Epoxy Molding Compound

Applicability to mold underfilling process

for Lead Frame

for Substrate

<Applications>

Environmentally Friendly Type

CSP, BGA, Stacked MCP and etc.

for Power Devices

Liquid Encapsulants

CEL-C Series

Thermoplastic Type

High Heat Resistant Coating Material

Process

HL Series

for Screen Printing HL-P Series

LOC Tape

HM Series

Map Molding Support Tape

RT Series

Display & Optics-Related

Characteristics (Typical Values)

Base Materials for PWBs

Item		Unit	CEL-1702 HF13	CEL-1802 HF19	CEL-9700 HF10	CEL-9750 HF10	CEL-9750 ZHF10
Applications		--	BOC	BOC	BGA, CSP
Flame retardant type		--	Metal hydroxide	Organic phosphorous	No flame retardant	No flame retardant	No flame retardant
Spiral flow		cm	90	90	110	145	150
Tg		°C	125	120	125	140	150
CTE	a1	ppm/°C	12	9	6	7	7
CTE	a2	ppm/°C	45	36	27	29	27
Flexural modulus		GPa	16	17	27	27	26
Mold shrinkage		%	0.32	0.35	0.10	0.10	0.08

Printed Wiring Boards

Advanced Performance Products

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