Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
for Substrate		inquiry	Semiconductor-Related
	This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features			Die Bonding Film
Small warpage after molding			DF, HS Series
Excellent reflow crack resistance			Dicing Die Bonding Film
Applicability to mold underfilling process			Underfill Film
			Epoxy Molding Compound
<Applications>			for Lead Frame
CSP, BGA, Stacked MCP and etc.			for Substrate
			Environmentally Friendly Type
			for Power Devices
			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Chemical-Related Materials
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