Hitachi Chemical Co. America, Ltd.

for Substrate

This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.

Features

  • Small warpage after molding
  • Excellent reflow crack resistance
  • Applicability to mold underfilling process

Applications

CSP, BGA, Stacked MCP and etc.

Process

Characteristics (Typical Values)

Item Unit CEL-1702 HF13 CEL-1802 HF19 CEL-9700 HF10 CEL-9750 HF10 CEL-9750
ZHF10
 Applications -- BOC BOC BGA, CSP
 Flame retardant type -- Metal hydroxide Organic phosphorous No flame retardant No flame retardant No flame retardant
 Spiral flow cm 90 90 110 145 150
 Tg °C  125 120 125 140 150
 CTE  a1 ppm/°C  12 9 6 7 7
 a2 ppm/°C  45 36 27 29 27
 Flexural modulus GPa 16 17 27 27 26
 Mold shrinkage % 0.32 0.35 0.10 0.10 0.08