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| electronics-related products>>semiconductor-related materials |
| Electronics-Related Materials | ||||||
 Environmentally Friendly Type HF Serires |
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 Semiconductor-Related |
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"CEL" HF series is an epoxy molding compound without halogen and antimony in the flame retardant. It shows excellent flammability, moldability and reflow crack resistance for various packages. | Interlayer Dielectric Material | ||||
 <HSG> |
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| CMP Slurry | ||||||
| for STI |
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| for Metals |
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| Die Bonding Paste | ||||||
| for Lead Frame |
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| for Substrate |
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| Features | Die Bonding Film | |||||
 Not including environmentally loaded flame retardant such as halogen and antimony |
DF, HS Series |
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| Halogen and antimony free in the flame retardant |
Dicing Die Bonding Film |
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| Excellent flammability and moldability |
Underfill Film |
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| Excellent reflow crack resistance(260oC) |
Epoxy Molding Compound | |||||
| for Lead Frame |
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| for Substrate |
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 Environmentally
Friendly Type |
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| for Power Devices |
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| Liquid Encapsulants | ||||||
| CEL-C Series |
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| Thermoplastic Type |
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| High Heat Resistant Coating Material | ||||||
| HL Series |
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| for Screen Printing HL-P Series |
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| LOC Tape | ||||||
| HM Series |
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| Map Molding Support Tape | ||||||
| RT Series |
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| Display & Optics-Related |
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| Base Materials for PWBs |
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| Printed Wiring Boards |
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| Advanced Performance Products | ||||||
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