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| electronics-related products>>semiconductor-related materials |
| Electronics-Related Materials | ||||||
 for Power Devices |
inquiry |
 Semiconductor-Related |
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"CEL" with high thermal conductivity and superior moldability is suitable for power devices. The power devices get higher thermal conductivity by combining "CEL" with our high thermal conductive die bonding paste. | Interlayer Dielectric Material | ||||
 <HSG> |
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| CMP Slurry | ||||||
| for STI |
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| for Metals |
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| Die Bonding Paste | ||||||
| for Lead Frame |
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| for Substrate |
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| Features | Die Bonding Film | |||||
 High thermal conductivity |
DF, HS Series |
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| Excellent filling propeties and moldability |
Dicing Die Bonding Film |
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| Underfill Film |
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| Applications | Epoxy Molding Compound | |||||
| Power transister, power IC and etc. | for Lead Frame |
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for Substrate |
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| Environmentally Friendly Type |
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 for
Power Devices |
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| Liquid Encapsulants | ||||||
| CEL-C Series |
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| Thermoplastic Type |
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| High Heat Resistant Coating Material | ||||||
| HL Series |
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| for Screen Printing HL-P Series |
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| LOC Tape | ||||||
| HM Series |
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| Map Molding Support Tape | ||||||
| RT Series |
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| Display & Optics-Related |
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| Base Materials for PWBs |
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| Printed Wiring Boards |
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| Advanced Performance Products | ||||||
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