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| electronics-related products>>semiconductor-related materials |
| Electronics-Related Materials | ||||||
 CEL-C Series |
inquiry |
 Semiconductor-Related |
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Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, EBGA, wafer level CSP and so on. | Interlayer Dielectric Material | ||||
 <HSG> |
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| CMP Slurry | ||||||
| for STI |
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| for Metals |
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| Die Bonding Paste | ||||||
| for Lead Frame |
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| for Substrate |
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| Features | Die Bonding Film | |||||
 Excellent moisture resistance & electrical properties |
DF, HS Series |
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| Excellent adhesion to the various types of substrates |
Dicing Die Bonding Film |
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| Low ionic impurities |
Underfill Film |
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| Minimum warpage by low CTE |
Epoxy Molding Compound | |||||
| for Lead Frame |
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| for Substrate |
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| Environmentally Friendly Type |
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| for Power Devices |
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| Liquid Encapsulants | ||||||
 CEL-C
Series |
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| Thermoplastic Type |
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| High Heat Resistant Coating Material | ||||||
| HL Series |
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| for Screen Printing HL-P Series |
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| LOC Tape | ||||||
| HM Series |
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| Map Molding Support Tape | ||||||
| RT Series |
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| Display & Optics-Related |
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| Base Materials for PWBs |
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| Printed Wiring Boards |
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| Chemical-Related Materials | ||||||
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| Products Alphabetical List | ||||||
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