Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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CEL-C Series

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Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend:
TCP, COF, EBGA, wafer level CSP and so on.

Interlayer Dielectric Material

CMP Slurry

Die Bonding Paste

Features

Die Bonding Film

Excellent moisture resistance & electrical properties .

Excellent adhesion to the various types of substrates.

Low ionic impurities.

Minimum warpage by low CTE.

Epoxy Molding Compound

Features and Characteristics (Typical Values)

Applications	Products	Featuers	Curing Conditions (°C/h)
TCP	CEL-C- 5020	It shows excellent film formability and voltage resistance.	120°C/20min+ 150°C/2h
COF (Underfill)	CEL-C- 3900	It is a non-filler type material, excellent impregnation and migration resistance	120°C/15min+ 150°C/1h
FC-BGA (Underfill)	CEL-C- 3720	It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp.	165°C/2h
WL-CSP	CEL-C- 7700	It enables to reduce wafer warpage due to low CTE.	130°C/1h+ 180°C/3h