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   electronics-related products>>semiconductor-related materials    
               Electronics-Related Materials
  CEL-C Series     inquiry   Semiconductor-Related
    Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, EBGA, wafer level CSP and so on.     Interlayer Dielectric Material
         <HSG>
      CMP Slurry
       for STI
         for Metals
        Die Bonding Paste
         for Lead Frame
               for Substrate
    Features      Die Bonding Film
  Excellent moisture resistance & electrical properties      DF, HS Series
  Excellent adhesion to the various types of substrates      Dicing Die Bonding Film
  Low ionic impurities      Underfill Film
  Minimum warpage by low CTE     Epoxy Molding Compound
         for Lead Frame
         for Substrate
         Environmentally Friendly Type
         for Power Devices
        Liquid Encapsulants
      CEL-C Series
         Thermoplastic Type
        High Heat Resistant Coating Material
         HL Series
         for Screen Printing HL-P Series
        LOC Tape
         HM Series
        Map Molding Support Tape
         RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
         Chemical-Related Materials
         Products Category List
         Products Alphabetical List
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