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   electronics-related products>>semiconductor-related materials    
               Electronics-Related Materials
  CEL-C Series     inquiry   Semiconductor-Related
    Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend:
TCP, COF, EBGA, wafer level CSP and so on.
    Interlayer Dielectric Material
         <HSG>
      CMP Slurry
       for STI
         for Metals
        Die Bonding Paste
         for Lead Frame
               for Substrate
    Features      Die Bonding Film
  Excellent moisture resistance & electrical properties .      DF, HS Series
  Excellent adhesion to the various types of substrates.      Dicing Die Bonding Film
  Low ionic impurities.      Underfill Film
  Minimum warpage by low CTE.     Epoxy Molding Compound
         for Lead Frame
    Features and Characteristics (Typical Values)      for Substrate
 
Applications Products Featuers Curing Conditions
(C/h)
 TCP CEL-C-
5020
It shows excellent film
formability and voltage
resistance.
120C/20min+
150C/2h
 COF
 (Underfill)
CEL-C-
3900
It is a non-filler type material, excellent impregnation and migration resistance 120C/15min+
150C/1h
 FC-BGA
 (Underfill)
CEL-C-
3720
It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp. 165C/2h
 WL-CSP CEL-C-
7700
It enables to reduce wafer warpage due to low CTE. 130C/1h+
180C/3h
     for Power Devices
      Liquid Encapsulants
    CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
       HL Series
       for Screen Printing HL-P Series
      LOC Tape
       HM Series
      Map Molding Support Tape
       RT Series
    Display & Optics-Related
    Base Materials for PWBs
    Printed Wiring Boards
       Advanced Performance    Products
   
       Products Category List
       Products Alphabetical List
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