Hitachi Chemical Co. America, Ltd.

CEL-C Series

Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, EBGA, wafer level CSP and so on.

Features

  • Excellent moisture resistance & electrical properties.
  • Excellent adhesion to the various types of substrates.
  • Low ionic impurities.
  • Minimum warpage by low CTE.

Features and Characteristics (Typical Values)

Applications Products Featuers Curing Conditions
(°C/h)
 TCP CEL-C-
5020
It shows excellent film
formability and voltage
resistance.
120°C/20min+
150°C/2h
 COF
 (Underfill)
CEL-C-
3900
It is a non-filler type material, excellent impregnation and migration resistance 120°C/15min+
150°C/1h
 FC-BGA
 (Underfill)
CEL-C-
3720
It shows excellent adhesion in humidity and excellent reflow resistance and thermal cycling resistance by making the CTE meet that of solder bmp. 165°C/2h
 WL-CSP CEL-C-
7700
It enables to reduce wafer warpage due to low CTE. 130°C/1h+
180°C/3h