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| electronics-related products>>semiconductor-related materials |
| Electronics-Related Materials | ||||||
 Thermoplastic Type <HIMAL> HIR Series |
inquiry |
 Semiconductor-Related |
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HIR series is a thermoplastic liquid encapsulant which forms high heat resistant coating film simply by drying the solvent at the low temperature. It has achieved no-warpage by very small curing shrinkage rate in the drying stage. | Interlayer Dielectric Material | ||||
 <HSG> |
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| CMP Slurry | ||||||
| for STI |
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| for Metals |
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| Die Bonding Paste | ||||||
| for Lead Frame |
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| for Substrate |
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| Features | Die Bonding Film | |||||
 High heat resistance |
DF, HS Series |
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| Low temperature curability |
Dicing Die Bonding Film |
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| Underfill Film |
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| Applications | Epoxy Molding Compound | |||||
| Thermal head printer |
for Lead Frame |
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| LCD driver IC (TCP/COG) |
for Substrate |
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| Power devices |
Environmentally Friendly Type |
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| BGA |
for Power Devices |
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| CSP |
Liquid Encapsulants | |||||
| CEL-C Series |
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 Thermoplastic
Type |
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| High Heat Resistant Coating Material | ||||||
| HL Series |
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| for Screen Printing HL-P Series |
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| LOC Tape | ||||||
| HM Series |
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| Map Molding Support Tape | ||||||
| RT Series |
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| Display & Optics-Related |
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| Base Materials for PWBs |
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| Printed Wiring Boards |
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| Advanced Performance Products | ||||||
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