Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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Electronics-Related Materials

HL Series

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Semiconductor-Related

HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200oC. This film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.

Interlayer Dielectric Material

CMP Slurry

Die Bonding Paste

Features

Die Bonding Film

High heat resistance.

DF, HS Series

Excellent solvent, acid and alkaline reisitance.

Dicing Die Bonding Film

Film formation at low temperature.

Underfill Film

Excellent stress reduction.

Epoxy Molding Compound

for Lead Frame

Applications

for Substrate

Junction coating resin for power devices .

Environmentally Friendly Type

Passivation for semiconductor devices .

for Power Devices

CEL-C Series

Thermoplastic Type

High Heat Resistant Coating Material

HL Series

for Screen Printing HL-P Series

LOC Tape

HM Series

Map Molding Support Tape

RT Series

Display & Optics-Related

Base Materials for PWBs

Characteristics (Typical Values)

Printed Wiring Boards

Item		Unit	HL-1200	HL-1450
Features		--	High heat reisitance	Low modulus
Liquid properties	Solid content	%	12	4.8
Liquid properties	Viscosity	Pa?s	0.5	1.1
Resin properties	Tg	°C	225	180
	Decomposition temp.	°C	400	390
	CTE	ppm/°C	50	100
	Elastic modulus	MPa	2,600	680

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