Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
HL Series		inquiry	Semiconductor-Related
	HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200oC. The film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features			Die Bonding Film
High heat resistance			DF, HS Series
Excellent solvent, acid and alkaline reisitance			Dicing Die Bonding Film
Film formation at low temperature			Underfill Film
Excellent stress reduction			Epoxy Molding Compound
			for Lead Frame
Applications			for Substrate
Junction coating resin for power devices			Environmentally Friendly Type
Passivation for semiconductor devices			for Power Devices
Anti-humidity coating for electronics components			Liquid Encapsulants
Anti-gas and humidity coating for electronics components			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Chemical-Related Materials
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