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   electronics-related products>>semiconductor-related materials    
               Electronics-Related Materials
  for Screen Printing HL-P Series inquiry   Semiconductor-Related
    HL-P series is a high heat resistant paste with screen printable capability. It has excellent adhesiveness with Si wafer and polyimides, and it is used as junction coating resin for power devices and compliant layer for wafer level CSP. It is also suitable for non-contact high accuracy dispensing.     Interlayer Dielectric Material
         <HSG>
      CMP Slurry
       for STI
       for Metals
        Die Bonding Paste
         for Lead Frame
               for Substrate
    Features      Die Bonding Film
  The main feature of HL-P500 is a polyimide series paste (varnish) with a particle-type      DF, HS Series
          soluble polyimide filler. While printing, the filler adds its thixotropic property to the      Dicing Die Bonding Film
          paste, so that the printing process goes more smoothly. Then, after baking process,      Underfill Film
          the filler dissolves in the base paste forming a uniform film. This is why the screened     Epoxy Molding Compound
           polyimide paste shows the excellent mechanical property and insulation.      for Lead Frame
         for Substrate
   Cross section of film      Environmentally Friendly Type
              for Power Devices
      Liquid Encapsulants
       CEL-C Series
       Thermoplastic Type
      High Heat Resistant Coating Material
   New                                                                  Conventional      HL Series
      for Screen Printing HL-P Series
   Other Features     LOC Tape
  Lactone type solvent is safe and used in our paste for low moisture absorption.      HM Series
         Therefore, it shows excellent workability and stability.     Map Molding Support Tape
  Excellent adhesion on silicon wafers and polyimide substrates.      RT Series
  Possibility of non-contact coating by using a dispenser.   Display & Optics-Related
      Base Materials for PWBs
   Applications   Printed Wiring Boards
  Junction coating film for power devices      Chemical-Related Materials
  Buffer coating film for semiconductor devices      Products Category List
  Reverse-side coating film of chips for improving solder reflow resistance      Products Alphabetical List
  Stress buffer for wafer level CSP      HOME
  Protective film for electronic parts      Hitachi Chemical. Co, Ltd.
       
   
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