HP series is a high heat resistant paste with screen printable capability. It is used as junction coating resin for power devices and compliant layer for wafer level CSP. It is also suitable for non-contact high accuracy dispensing
Possibility of non-contact coating by using a dispenser.
Applications
Junction coating film for power devices
Buffer coating film for semiconductor devices
Stress buffer for wafer level CSP
Protective film for electronic parts
Process
Screen printing process is an attractive way of simplifying semiconductor manufacturing process. It requires a mesh or metal screen. A screen printer aligns the screen in a substrate fixed on the table by air pressure, and then prints the screen pattern onto the substrate, applying paste with a brush. Mainly for this process, Hitachi Chemical has developed two new types of polyimide pastes. One of the type is "HP-500" series based on polyimide paste as heat-resistant paste with the printing function. The other type is "HP-200" series based on polyamideimide paste. These pastes are very useful for the development and design of advanced semiconductors.
Application for WL-CSP
It is an efficient way to use the paste, while spin-on coating process wastes large amount of the paste.
Thick coating and fine patterns in large scale wafer (up to 300mm in diameter) can be obtained by single printing.
Characteristics (Typical Values)
Item
Unit
HP-500
HP-300
HP-200
Test method
Features
--
Polyimide type
High heat resistant
High Insulation
Polyamideimide type
"Low temp. film formation"
Polyamideimide type
"Low temp. film formation"
Low elastic modulus
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Semiconductor-Related
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HL Series
The main feature of HP-500 is a polyimide series paste (varnish) with a particle-type
for
Screen Printing HP Series
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