Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
for Screen Printing HL-P Series		inquiry	Semiconductor-Related
	HL-P series is a high heat resistant paste with screen printable capability. It has excellent adhesiveness with Si wafer and polyimides, and it is used as junction coating resin for power devices and compliant layer for wafer level CSP. It is also suitable for non-contact high accuracy dispensing.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features			Die Bonding Film
The main feature of HL-P500 is a polyimide series paste (varnish) with a particle-type			DF, HS Series
soluble polyimide filler. While printing, the filler adds its thixotropic property to the			Dicing Die Bonding Film
paste, so that the printing process goes more smoothly. Then, after baking process,			Underfill Film
the filler dissolves in the base paste forming a uniform film. This is why the screened			Epoxy Molding Compound
polyimide paste shows the excellent mechanical property and insulation.			for Lead Frame
			for Substrate
Cross section of film			Environmentally Friendly Type
			for Power Devices
			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
New Conventional			HL Series
			for Screen Printing HL-P Series
Other Features			LOC Tape
Lactone type solvent is safe and used in our paste for low moisture absorption.			HM Series
Therefore, it shows excellent workability and stability.			Map Molding Support Tape
Excellent adhesion on silicon wafers and polyimide substrates.			RT Series
Possibility of non-contact coating by using a dispenser.			Display & Optics-Related
			Base Materials for PWBs
Applications			Printed Wiring Boards
Junction coating film for power devices			Chemical-Related Materials
Buffer coating film for semiconductor devices			Products Category List
Reverse-side coating film of chips for improving solder reflow resistance			Products Alphabetical List
Stress buffer for wafer level CSP			HOME
Protective film for electronic parts			Hitachi Chemical. Co, Ltd.

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