Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
HM Series		inquiry	Semiconductor-Related
	HM series is die bonding tape for LOC packages. It contains a high heat resistant thermoplastic resin in the adhesive, widely known as an overcoating material for semiconductors. It shows excellent stability and easy handling capability.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features			Die Bonding Film
Bondable in short time with hot-melt type			DF, HS Series
Low outgassing and impurities guarantee high reliability			Dicing Die Bonding Film
High heat resistance and excellent reflow crack resistance			Underfill Film
Easy to handle with no adhesiveness at room temperature and excellent stability			Epoxy Molding Compound
			for Lead Frame
			for Substrate
			Environmentally Friendly Type
			for Power Devices
			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Advanced Performance Products
			Advanced Performance Products
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