Hitachi Chemical Co. America, Ltd. [semiconductor-related materials]

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			Electronics-Related Materials
RT Series		inquiry	Semiconductor-Related
	RT series is used in the map molding process of semiconductor packages such as QFN and SON. Attaching on the reverse face of a lead frame, RT series has achieved no flush burr after molding and high productivity in wire bonding. The applications have been expanded to new packages besides QFN and SON, and we are looking for new other applications using the excellent high heat resistance feature.		Interlayer Dielectric Material
			<HSG>
			CMP Slurry
			for STI
			for Metals
			Die Bonding Paste
			for Lead Frame
			for Substrate
Features			Die Bonding Film
Thermoplastic resin with high thermal stability for adhesive layer			DF, HS Series
Good wire bondability by high Tg and high thermal stability			Dicing Die Bonding Film
No flash burr after molding by high Tg			Underfill Film
No adhesive on lead frame after removing tape			Epoxy Molding Compound
Low adhesiveness of the tape at room temperature achieves no dust attachment			for Lead Frame
			for Substrate
			Environmentally Friendly Type
			for Power Devices
			Liquid Encapsulants
			CEL-C Series
			Thermoplastic Type
			High Heat Resistant Coating Material
			HL Series
			for Screen Printing HL-P Series
			LOC Tape
			HM Series
			Map Molding Support Tape
			RT Series
			Display & Optics-Related
			Base Materials for PWBs
			Printed Wiring Boards
			Chemical-Related Materials
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