hitachi.com  |  hitachi.us  |  hitachi chemical co., ltd.  |   Hitachi Chemical DuPont MicroSystems, LLC.       North America
  |    home    |    products    |    contact us    |
Search by Google
 
   electronics-related products>>semiconductor-related materials    
               Electronics-Related Materials
  RT Series     inquiry   Semiconductor-Related
    RT series is used in the map molding process of semiconductor packages such as QFN and SON. Attaching on the reverse face of a lead frame, RT series has achieved no flush burr after molding and high productivity in wire bonding. The applications have been expanded to new packages besides QFN and SON, and we are looking for new other applications using the excellent high heat resistance feature.     Interlayer Dielectric Material
         <HSG>
      CMP Slurry
       for STI
       for Metals
      Die Bonding Paste
       for Lead Frame
               for Substrate
    Features      Die Bonding Film
  Thermoplastic resin with high thermal stability for adhesive layer      DF, HS Series
  Good wire bondability by high Tg and high thermal stability      Dicing Die Bonding Film
  No flash burr after molding by high Tg      Underfill Film
  No adhesive on lead frame after removing tape     Epoxy Molding Compound
  Low adhesiveness of the tape at room temperature achieves no dust attachment      for Lead Frame
         for Substrate
         Environmentally Friendly Type
         for Power Devices
        Liquid Encapsulants
         CEL-C Series
         Thermoplastic Type
        High Heat Resistant Coating Material
         HL Series
         for Screen Printing HL-P Series
        LOC Tape
         HM Series
        Map Molding Support Tape
      RT Series
      Display & Optics-Related
      Base Materials for PWBs
      Printed Wiring Boards
         Chemical-Related Materials
         Products Category List
         Products Alphabetical List
         HOME
         Hitachi Chemical. Co, Ltd.
       
   
Page Top