Hitachi Chemical Co. America, Ltd.

Die Bonding Film

Dicing Die Bonding Film HR & FH Series

FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer. FH series is a co-developed product with The Furukawa Electric Co., Ltd.

Underfill Film UF Series

UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.