Hitachi Chemical Co. America, Ltd.

Die Bonding Paste

for Lead Frame

EPINAL ™ has been used as die bonding adhesiv semiconductor devices. We have a top-level market share in die bonding paste.

for Substrate

EPINAL ™ has an excellent adhesion to various materials. adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.