Hitachi Chemical is a leading company of C e O 2 slurry for STI. "GPX" is excellent for polishing and it is suitable for finer patterns.
"GPX" has two types: HS-C series for Cu and HS-T series for barrier metals. The polishing performance is controllable for various processes and devices.
" EPINAL" has been used as die bonding adhesiv semiconductor devices. We have a top-level market share in die bonding paste.
" EPINAL" has an excellent adhesion to various materials. adhesiveness is controllable for different chip sizes and die bonding condition. It is available for Pb-free reflow.
DF, HS series are die bonding films, necessary for high performance packages such as stacked MCP and BGA. We have a top share in the die bonding film market. The uniform die bonding layer can be obtained by a simple laminating process.
FH series is a two-in-one film with the functions for both dicing tape and die bonding film. Enabling both tapes to be laminated to a wafer at a time, it achieves easy handling of thinner wafer. FH series is a co-developed product with The Furukawa Electric Co., Ltd.
UF series has achieved flip chip interconnection only by applying heat and pressure without conventional liquid underfilling. Two types are available: with and without conductive particles. It can be available for various connection methods.
Hitachi Chemical has a top-level market share in epoxy molding compounds. Our products meet the customers' demands and the changes of package trends.
This type is suitable for BGA and CSP, and has low warpage and excellent reflow crack resistance. It is also applicable for packages with narrow pad pitch and long wire.
"CEL" HF series is an epoxy molding compound without halogen and antimony in the flame retardant. It shows excellent flammability, moldability and reflow crack resistance for various packages.
"CEL" with high thermal conductivity and superior moldability is suitable for power devices. The power devices get higher thermal conductivity by combining "CEL" with our high thermal conductive die bonding paste.
Hitachi Chemical develops various types of liquid encapsulants along the cutting-edge package trend: TCP, COF, EBGA, wafer level CSP and so on.
HIR series is a thermoplastic liquid encapsulant which forms high heat resistant coating film simply by drying the solvent at the low temperature. It has achieved no-warpage by very small curing shrinkage rate in the drying stage.
HL series is a high heat resistant coating material which forms high reliable film simply by drying the solvent at below 200oC. The film is suitable for various electronic parts and semiconductor devices by excellent flexibility, toughness and low warpage.
HL-P series is a high heat resistant paste with screen printable capability. It has excellent adhesiveness with Si wafer and polyimides, and it is used as junction coating resin for power devices and compliant layer for wafer level CSP. It is also suitable for non-contact high accuracy dispensing.
HM series is die bonding tape for LOC packages. It contains a high heat resistant thermoplastic resin in the adhesive, widely known as an overcoating material for semiconductors. It shows excellent stability and easy handling capability.
RT series is used in the map molding process of semiconductor packages such as QFN and SON. Attaching on the reverse face of a lead frame, RT series has achieved no flush burr after molding and high productivity in wire bonding. The applications have been expanded to new packages besides QFN and SON, and we are looking for new other applications using the excellent high heat resistance feature.