HM series is die bonding tape for LOC packages. It contains a high heat resistant thermoplastic resin in the adhesive, widely known as an overcoating material for semiconductors. It shows excellent stability and easy handling capability.
Bondable in short time with hot-melt type
Low outgassing and impurities guarantee high reliability
High heat resistance and excellent reflow crack resistance
Easy to handle with no adhesiveness at room temperature and excellent stability